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a-Si TFTs on Thin Steel Foil Substrates: How Thin Can We Go?

Published online by Cambridge University Press:  10 February 2011

Eugene Ma  and
Sigurd Wagner
Sigurd Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08540
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Abstract

The mechanics of thin film-substrate couples indicates that mechanical stress in the active electronic layer can be reduced when films are deposited onto thinner substrates. To explore the question of just how thin a substrate can be, a-Si:H TFTs are fabricated on thin steel foil substrates of various thickness, and performance metrics from devices on each of the substrates are measured and compared.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 558: Symposium B – Flat-Panel Displays and Sensors-Principles, Materials… , 1999 , 381
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

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