Hostname: page-component-84b7d79bbc-7nlkj Total loading time: 0 Render date: 2024-07-25T13:57:29.508Z Has data issue: false hasContentIssue false

The Cellular Automaton Simulation of Microstructural Evolution During Deformation Processing of Metals

Published online by Cambridge University Press:  15 February 2011

Chris H.J. Davies*
Affiliation:
Department of Materials Engineering, Monash University, Clayton, Victoria, Australia, 3800. E-mail: Chris.Davies@eng.monash.edu.au
Get access

Abstract

The computer simulation of the evolution of microstructure during deformation processing is a desirable but elusive goal. In order to be effective, models must be tied to deformation parameters (temperature, strain rate, strain), and grain size distributions and recrystallisation kinetics must be predicted with high accuracy if the evolution of microstructure is to be tracked through several passes. This paper examines the cellular automaton (CA) simulation technique which has the potential to enable the modeller to accomplish these goals.

Aspects of the CA approach examined are the three dimensional representation of microstructure and its evolution and the incorporation of texture representation into simulations.Also investigated will be the limitations of the technique, in terms of the error that can be expected when different boundary conditions are imposed on a simulation.

Although at a rudimentary stage of investigation, the interfacing of CA simulations to deformation simulations (eg, finite element) will be examined. The paper concludes with a discussion of the challenges facing the implementation of CA simulations in industrial process models.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hesselbarth, H.W. and Gobel, I.R., Acta Metall. Mater., 39, 21352143 (1991).Google Scholar
2. Goetz, R.L. and Seetharaman, V., Metall. Mater. Trans A, 29A, 23072321 (1998).Google Scholar
3. Marx, V., Raabe, D., Engler, O., and Gottstein, G., Textures and Microstructures, 28, 211218(1997)Google Scholar
4. Marx, V., Reher, F.H., and Gottstein, G., Acta Mater., 47, 12191230 (1999).Google Scholar
5. Davies, C.H.J., Scripta Metall. Mater., 33, 11391143 (1995).Google Scholar
6. Davies, C.H.J., Scripta Mater., 36, 3540 (1997).Google Scholar
7. Davies, C.H.J. and Hong, L., Scripta Mater., 40, 11451150 (1999).Google Scholar
8. Mahin, K.W. Hanson, K., and Morris, J.W., Acta Metall., 28, 443453 (1980).Google Scholar
9. Marthinsen, K., Lohne, O., and Nes, E., Acta Metall., 37, 135145 (1989).Google Scholar
10. Furu, T., Marthinsen, K., and Nes, E., Mater. Sci. Tech., 6, 10931102 (1990).Google Scholar
11. Jensen, D. Juul, Scripta Metall. Mater., 27, 15511556 (1992).Google Scholar
12. Srolovitz, D.J., Grest, G.S., and Anderson, M.P., Acta Metall., 34, 18331845 (1986).Google Scholar
13. Srolovitz, D.J., Grest, G.S., Anderson, M.P., and Rollett, A.D., Acta MetalL, 37, 21152128 (1989).Google Scholar
14. Miodownik, M., Godfrey, A.W., Holm, E.A., and Hughes, D.A., Acta Mater., 47, 26612668 (1999).Google Scholar
15. Rollet, A.D., Progr. Mat. Sci., 42, 7999 (1997).Google Scholar
16. Rappaz, M., and Gandin, Ch.-A., Acta Metall. Mater., 41, 345360 (1993).Google Scholar
17. Gokhale, A.M., and DeHoff, R.T., Metall. Trans., 16A, 559564 (1985).Google Scholar
18. Fletcher, S., Thomson, M., and Tran, T., J. Electroanal. Chem., 199, 241247 (1986).Google Scholar
19. Jensen, D. Juul, Metall. and Mater. Trans., 28A, 1525 (1997).Google Scholar
20. Huang, Y. and Humphreys, F.J., Acta Mater., 47, 22592268 (1999).Google Scholar
21. Sellars, C.M., in Proc. Intl. Conf on Thermomechanical Processing: in Theory, Modelling and Practice, ed Hutchinson, B. et al. (Swedish Soc. for Materials Technology, Stockholm, Sweden 1997), p. 3551.Google Scholar
22. Orsetti Rossi, P.L. and Sellars, C.M., Mater. Sci. Technol., 15, 193201 (1999).Google Scholar