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Chemical Vapor Deposition by Pulsed Ultrasonic Direct Injection of Liquid Precursors Produces Versatile Method for Creation of Thin Film Circuits and Devices.

Published online by Cambridge University Press:  17 March 2011

Mark W. Leiby
Mark W. Leiby*
Affiliation:
Applications Engineer Sono-Tek Corporation Milton, New York 12547
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Abstract

We demonstrate a unique, ultrasonic direct injection method that employs nanophase materials (e.g. polymers, metal-organic and ceramic precursors). By use of in situ process control, and modification of process parameters, morphology, and structure may be varied to produce desired characteristics. By sequential application of these strategies one may fabricate MEMS, OLED's, deposit conformal coatings, create surface acoustic wave (SAW) chemical sensors, and many other thin film circuits and devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 698: Symposia Q/EE Electroative Polymers and Rapid Prototyping , 2001 , 1
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

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