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Chemistry of Adhesion at the Polyimide-Metal Interface

Published online by Cambridge University Press:  21 February 2011

M. Grunze ,
W. N. Unertl ,
S. Gnanarajan  and
J. French
M. Grunze
Affiliation:
Laboratory for Surface Science and Technology and Department of Physics, University of Maine, Orono, ME 04469.
W. N. Unertl
Affiliation:
Laboratory for Surface Science and Technology and Department of Physics, University of Maine, Orono, ME 04469.
S. Gnanarajan
Affiliation:
Laboratory for Surface Science and Technology and Department of Physics, University of Maine, Orono, ME 04469.
J. French
Affiliation:
Laboratory for Surface Science and Technology and Department of Physics, University of Maine, Orono, ME 04469.
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Abstract

This article describes recent studies of the chemistry of adhesion between thin (d ≥ 11 Å) polyimide films and silver and copper substrates, and the structural changes in the polymer when polyamic acid is imidized to polyimide. The thin polyamic acid films were formed by vapor phase deposition of 1,2,4,5-benzenetetracarboxylic anhydride (PMDA) and 4,4-oxydianiline (ODA) under high vacuum conditions and subsequent imidization by heating in vacuum. Both ODA and PMDA are at least partially dissociated upon adsorption onto clean copper and silver and with increasing film thicknesses react to form the polyimide precursor, polyamic acid. Heating to T ≥ 425 K leads to polymerization to form polyimide films which are thermally stable to about 700 K. Polyimide films with mean thicknesses as small as 1.1 nm have been fabricated in this way and their bonding to the substrate as determined by x-ray photoemission studies is su marized. Infrared reflection absorption data gives further evidence that the polyimide bonds to the substrate via fragmented PMDA. Changes in the surface topography and molecular structure of the films during imidization are demonstrated by scanning tunneling micrographs and infrared reflection absorption data.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 189
Copyright
Copyright © Materials Research Society 1988

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Footnotes

*

Present address: Lehrstuhl fuer Angewandte Physikalische Chemie, Institut fuer Physikalische Chemie, Universitaet Heidelberg, Im Neuenheimer Feld 253, 6900 Heidelberg, West Germany.

References

REFERENCES

1. “Polymer Materials for Electronic Applications,” ACS Symp. Ser., 184 (1982).Google Scholar
2. “Polyimide - Synthesis, Characterization and Application,” Vol.1, Ed. Mittal, K.L., Plenum (1984).Google Scholar
3.Wilson, A.M., Thin Solid Films, 83 (1981) 145.Google Scholar
4.Larsen, R.A., IBM J. Res. Develop., 24 (1980) 268.Google Scholar
5.Mastroianni, S., Solid State Tech., May, (1984) 155.Google Scholar
6.Mittal, K.L., in “Microscopic Aspects of Adhesion and Lubrication,” Tribology Series Vol.7, Ed. Georges, J.M., Pub. Elsevier, Amsterdam (1982).Google Scholar
7.Chou, N.J. and Tang, C.H., J. Vac. Sci. Technol. A, 2 (1984) 751.Google Scholar
8.Jordan, J.L., Sanda, P.N., Morar, J.F., Kovac, C.A., Himpsel, F.J. and Polak, R.A., J. Vac. Sci. Technol., A, 4 (1986) 1046.Google Scholar
9.Sanda, P.N., Bartha, J.W., Clabes, J.G., Jordan, J.L., Feger, C., Silverman, B.D. and Ho, P.S., J. Vac. Sci. Technol., A, 4 (1986) 1035.Google Scholar
10.Jordan, J.L., Kovac, C.A., Morar, J.F. and Pollak, R.A., Phys. Rev. B (in press) (1987).Google Scholar
11.Ho, P.S., Hahn, P.O., Bartha, J.W., Rubloff, G.W., LeGoues, F.K. and Silverman, B.D., J. Vac. Sci. Technol. A, 3 (1985) 739.Google Scholar
12.Ohuchi, F.S. and Freilich, S.C., J. Vac. Sci. Technol. A, 4 (1986) 1039.Google Scholar
13.Chou, N.J., Dong, D.W., Kim, J. and Liu, A.C., J. Electrochem. Soc. 131, (1984) 2335.Google Scholar
14.Chauvin, C., Sacher, E., Yelon, A., Groleau, R. and Gujrathi, S., preprint (1987).Google Scholar
15.DiNardo, N.J., Demuth, J.E. and Clarke, T.C., Chem. Phys. Letts. 121 (1985) 239.Google Scholar
16.Pireaux, J.J., Gregoire, C., Thiry, P.A., Caudano, R. and Clarke, T.C., J. Vac. Sci. Tech. A, 5 (1987) 598.Google Scholar
17.Kim, Y.-H., Walker, G.F., Kim, J. and Park, J., International Conference on Metallurgical Coatings (San Diego) p. 23–27 (1987).Google Scholar
18.Jordan, J.L., Kovac, C.A., Morar, J.F. and Pollak, R.A., Phys. Rev. B, July 15 (1987).Google Scholar
19.Salem, J.R., Sequeda, F.O., Duran, J., Lee, W.Y. and Yang, R.M., J. Vac. Sci. Technol. A, 4 (1986) 369.Google Scholar
20.Grunze, M. and Lamb, R.N., Chem. Phys. Letts., 133 (1987) 283.Google Scholar
21.Lamb, R.N., Baxter, J., Grunze, M., Kong, C.W. and Unertl, W.N., Langmuir (in press) (1987).Google Scholar
22.Kowalczyk, S.P., Kim, Y.H., Walker, G.F., Kim, J., preprint.Google Scholar
23.Lamb, R.N. and Grunze, M., J. Chem. Phys., submitted.Google Scholar
24.Grunze, M., Baxter, J.P., Kong, C.W., Lamb, R.N., Unertl, W.N. and Brundle, C.R., to be published in Proceedings of the American Vacuum Society Topical Conference on Deposition and Growth: Limits for Microelectronics, Anaheim, CA, November 1987.Google Scholar
25.Lamb, R.N., Stöhr, J., Grunze, M., in preparation.Google Scholar
26.Gnanarajan, S., French, J., Grunze, M., in preparation.Google Scholar
27.The Aldrich Library of FT-IR Spectra, Pouchert, Charles T., Ed., Aldrich Chemical Company, Inc., 1985.Google Scholar
28.Stuve, E.M., Madix, R.J. and Sexton, B.A., Surf. Sci., 119 (1982) 279.Google Scholar
29.Russell, T.P., Journal of Polymer Science, Polymer Physics edition, Vol.22, (1984) 1105.Google Scholar
30.Ishida, H., Wellininghoff, S.T., Bauer, E., and Koenig, L.L., Macromolecules 13 (1980) 826.Google Scholar
31.Tobin, M.C., “Laser and Raman Spectroscopy,” Wiley Interscience, New York, 1971.Google Scholar