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A Comparison of the Metallurgical Behavior of Gold and Copper Wires in Ball Bonding

Published online by Cambridge University Press:  26 February 2011

Tomohiro Uno ,
K. Tatsumi ,
K. Mizuno ,
O. Kitamura  and
Y. Ohno
Tomohiro Uno
Affiliation:
R&D Laboratories I, Nippon Steel Corporation, 1618 Ida, Nakahara-ku, Kawasaki 211, Japan
K. Tatsumi
Affiliation:
R&D Laboratories I, Nippon Steel Corporation, 1618 Ida, Nakahara-ku, Kawasaki 211, Japan
K. Mizuno
Affiliation:
R&D Laboratories I, Nippon Steel Corporation, 1618 Ida, Nakahara-ku, Kawasaki 211, Japan
O. Kitamura
Affiliation:
R&D Laboratories I, Nippon Steel Corporation, 1618 Ida, Nakahara-ku, Kawasaki 211, Japan
Y. Ohno
Affiliation:
R&D Laboratories I, Nippon Steel Corporation, 1618 Ida, Nakahara-ku, Kawasaki 211, Japan
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Abstract

A comparison was made of gold and copper wires used in ball bonding in terms of their mechanical properties, bondability and the reliability of their bond interfaces in elevated temperature environments. The ball bondability of copper and gold was evaluated through clarification of the factors which govern ball deformability. Moreover a bonding method to suppress the generation of silicon cracks was proposed for ball bonding of copper wire. As to the reliability of the heat affected zone and the bond interfaces, copper wire was found to be superior to gold wire.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 43
Copyright
Copyright © Materials Research Society 1991

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