Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-04T18:01:18.223Z Has data issue: false hasContentIssue false
  • English
  • Français

Comparison of Three Low Dielectric Constant Organic Polymers

Published online by Cambridge University Press:  15 February 2011

C. B. Case ,
C. J. Case ,
A. Kornblit ,
M. E. Mills ,
D. Castillo  and
R. Liu
C. B. Case
Affiliation:
Bell Laboratories - Lucent Technologies, Murray Hill, NJ 07974
C. J. Case
Affiliation:
Bell Laboratories - Lucent Technologies, Murray Hill, NJ 07974
A. Kornblit
Affiliation:
Bell Laboratories - Lucent Technologies, Murray Hill, NJ 07974
M. E. Mills
Affiliation:
The Dow Chemical Company, Midland, MI 48674
D. Castillo
Affiliation:
The Dow Chemical Company, Midland, MI 48674
R. Liu
Affiliation:
Bell Laboratories - Lucent Technologies, Murray Hill, NJ 07974
Get access

Abstract

Three low dielectric constant organic polymers are being investigated for possible use in a conventional, subtractive etch, multi-level metal process with PVD Al plugs. Material properties, physical properties, planarization ability and etch chemistries are compared, as well as the possibility of using these materials in a low temperature PVD A1 plug process.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 443: Symposium H – Low-Dielectric Constant Materials II , 1996 , 177
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Mills, M. E., Dibbs, M., Martin, S. J. and Townsend, P. H., Dielectrics for ULSI Multilevel Interconnection Conference, p. 269, Feb. 21–22, 1995.Google Scholar
2. Martin, S. J., Mills, M. E., Townsend, P. H. and Castillo, D. W. in Advanced Metallization and Interconnect Systems for ULSI Applications in 1995, edited by Ellwanger, R. C. and S-Q, Wang, (Mater. Res. Soc. Proc. Pittsburgh, PA, 1996) pp. 23–28.Google Scholar
3. Case, C. B., Komblit, A. and Sapjeta, J., VLSI Multilevel Interconnection Conference, p. 63, June 18 – 20, 1996.Google Scholar
4. A product of The Dow Chemical Company, sold under the name Cyclotene.Google Scholar
5. Mercer, F. W. and Sovish, R., U. S. Pat. No. 5,115,082 (assigned to AlliedSignal).Google Scholar
6. Hendricks, N. H., presented at the SRC Conference on Low Dielectric Constant Interlayer Dielectrics for High Performance Circuits, Rensselaer Polytechnic Institute, Aug. 9–10, 1994.Google Scholar
7. Hendricks, N. H., Wan, B. and Smith, A., Dielectrics for ULSI Multilevel Interconnection Conference, p. 283 (1995).Google Scholar
8. Hendricks, N. H., Lau, K. S. Y., Smith, A. R. and Wan, W. B., presented at the MRS Conference, San Fransisco, CA, April 17, 1995.Google Scholar
9. Case, C. B., Kornblit, A., Lau, K. S. Y., and Hendricks, N. H., VLSI Multilevel Interconnection Conference, p. 116, June. 27–29, 1995.Google Scholar
10. Forester, L., Choi, D. K., Hosseini, R., Lee, J., Tredinnick, B., Holland, K., Cale, T., VLSI Multilevel Interconnection Conference, p. 482, June. 27–29, 1995.Google Scholar
11. Lau, K. S. Y., Drage, J. S., Hacker, N. P., , N, Rutherford, M., Katsanes, R. R., Korolev, B. A., Krajewski, T. A., Lefferts, S. P., Sayed, H., Sebahar, P. R., Smith, A. R., Wan, W. B. and White, E. C., VLSI Multilevel Interconnection Conference, p. 92 (1996).Google Scholar
12. Babb, D. A., Rondan, N. G. and Smith, D. W., presented at the 209th National ACS Meeting, April 1995, Polymer Preprints, 36 (1), p. 721 (1995).Google Scholar
13. Babb, D. A., Ezzell, B. R., Clement, K. S., Richey, W. F. and Kennedy, A. P., J. Polym. Sci., Part A: Polym. Chem., 31, p. 3465 (1993).Google Scholar
14. Kennedy, A. P., Babb, D. A., Bremmer, J. N. and Pasztor, A. J. Jr.,, J. Polym. Sci., Part A: Polym. Chem., 33, p. 1859 (1995).Google Scholar
15. Case, C. B., Case, C. J., Kornblit, A., Mills, M. E. and Castillo, D., Advanced Metallization and Interconnect Systems for ULSI Applications, Boston, Oct. 1–3, 1996.Google Scholar
16. Developed by The Dow Chemical Company.Google Scholar
17. Schier, M., J. Electrochem. Soc., Vol.142, No. 9, p. 3238, Sept. 1995.Google Scholar
18. Lii, Y. T. and Wetzel, J., presented at the spring Electrochemical Society Meeting, 1995.Google Scholar
19. Kornblit, A., Grieco, M. J., Peters, D. W. and Saunders, T. E., SPIE 775, p. 320 (1987).Google Scholar
20. Townsend, P. H., Shaffer, E. O., Mills, M. E., Radler, M. J. and Blackson, J., presented at the SEMATECH Low Dielectric Constant Materials and Interconnect Workshop, April 30 - May 1, 1996.Google Scholar