Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Martino, Taylor
Partovi-Nia, Raheleh
Chen, Jian
Qin, Ziqiang
and
Shoesmith, David W.
2014.
Mechanisms of Film Growth on Copper in Aqueous Solutions Containing Sulphide and Chloride under Voltammetric Conditions.
Electrochimica Acta,
Vol. 127,
Issue. ,
p.
439.
Chen, J.
Qin, Z.
and
Shoesmith, D. W.
2014.
Key parameters determining structure and properties of sulphide films formed on copper corroding in anoxic sulphide solutions.
Corrosion Engineering, Science and Technology,
Vol. 49,
Issue. 6,
p.
415.
Zhang, Bowei
Hao, Shiji
Wu, Junsheng
Li, Xiaogang
and
Huang, Yizhong
2016.
Evidence of a nanosized copper anodic reaction in an anaerobic sulfide aqueous solution.
RSC Advances,
Vol. 6,
Issue. 24,
p.
19937.
Chen, J.
Qin, Z.
Martino, T.
and
Shoesmith, D.W.
2017.
Non-uniform film growth and micro/macro-galvanic corrosion of copper in aqueous sulphide solutions containing chloride.
Corrosion Science,
Vol. 114,
Issue. ,
p.
72.
Chen, J.
Qin, Z.
Martino, T.
and
Shoesmith, D. W.
2017.
Effect of chloride on Cu corrosion in anaerobic sulphide solutions.
Corrosion Engineering, Science and Technology,
Vol. 52,
Issue. sup1,
p.
40.
Tissot, I.
Monteiro, O. C.
Barreiros, M. A.
Correia, J.
and
Guerra, M. F.
2017.
The influence of the constituent elements on the corrosion mechanisms of silver alloys in sulphide environments: the case of sterling silver.
RSC Advances,
Vol. 7,
Issue. 45,
p.
28564.
Vance, Eric R.
Grant, Charmaine
Karatchevtseva, Inna
Aly, Zaynab
Stopic, A.
Harrison, Jennifer
Thorogood, Gordon
Wong, Henri
and
Gregg, Daniel J.
2018.
Immobilization of iodine via copper iodide.
Journal of Nuclear Materials,
Vol. 505,
Issue. ,
p.
143.
Martino, T.
Smith, J.
Chen, J.
Qin, Z.
Noël, J. J.
and
Shoesmith, D. W.
2019.
The Properties of Electrochemically-Grown Copper Sulfide Films.
Journal of The Electrochemical Society,
Vol. 166,
Issue. 2,
p.
C9.
Martino, T.
Chen, J.
Guo, M.
Ramamurthy, S.
Shoesmith, D. W.
and
Noël, J. J.
2019.
Comments on E. Huttunen-Saarivirta et al., “Kinetic Properties of the Passive Film on Copper in the Presence of Sulfate-Reducing Bacteria” [J. Electrochem. Soc., 165, C450 (2018)].
Journal of The Electrochemical Society,
Vol. 166,
Issue. 10,
p.
Y13.
Chen, Jian
Pan, Xinran
Martino, Taylor
Lilja, Christina
Behazin, Mehran
Binns, Wilfred J.
Keech, Peter G.
Noël, James J.
and
Shoesmith, David W.
2023.
The effects of chloride and sulphate on the growth of sulphide films on copper in anoxic sulphide solutions.
Materials and Corrosion,
Vol. 74,
Issue. 11-12,
p.
1665.
Chae, Nakkyu
Park, Samuel
Seo, Seungjin
Foster, Richard I.
Ju, Heejae
and
Choi, Sungyeol
2023.
Coupled mixed-potential and thermal-hydraulics model for long-term corrosion of copper canisters in deep geological repository.
npj Materials Degradation,
Vol. 7,
Issue. 1,
Hedin, Allan
Lilja, Christina
King, Fraser
Shoesmith, David W.
and
Keech, Peter G.
2023.
Comment on “Penetration of corrosive species into copper exposed to simulated O2-free groundwater by time-of-flight secondary ion mass spectrometry (ToF-SIMS)”.
Corrosion Science,
Vol. 217,
Issue. ,
p.
111136.
Ramamurthy, S.
Chen, J.
Zagidulin, D.
Henderson, J.D.
Lilja, C.
Bergendal, E.
Behazin, M.
Diomidis, N.
Keech, P.G.
Noël, J.J.
and
Shoesmith, D.W.
2024.
The influences of traces of oxygen and sulfide on the corrosion of copper in concentrated chloride solutions.
Corrosion Science,
Vol. 233,
Issue. ,
p.
112047.