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Copper Interactions in Thick Film Multilayer Ceramics: Dielectric Blushing and Performance

Published online by Cambridge University Press:  25 February 2011

D. P. Button  and
V. P. Siuta
D. P. Button
Affiliation:
– Invited Paper E. I. du Pont de Nemours and Company, Photosystems and Electronic Products Dept., Experimental Station, Wilmington, DE 19898.
V. P. Siuta
Affiliation:
– Invited Paper E. I. du Pont de Nemours and Company, Photosystems and Electronic Products Dept., Experimental Station, Wilmington, DE 19898.
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Abstract

As the popularity of copper metallizations grows in ceramic-based electronic applications, an understanding of copper-ceramic interactions during firing assumes greater technological importance. Copper metallizations often interact with thick film microcircuit dielectrics during the firing of multilayer interconnects to yield rosy discoloration, or so-called blushing or staining of this insulating ceramic. In the conventional filled-glass dielectrics studied here, blushing is concentrated at special interfaces over Cu conductors where submicron Cu precipitates are localized. Several firing strategies which improve binder burnout can be employed using standard belt furnaces to depress, if not prevent, this precipitation. A multistage blushing mechanism is proposed that is dominated by the reduction of Cu ions in the ceramic by carbonaceous products formed when firing dielectric compositions under non-oxidizing conditions. Dielectric glass composition also plays an important role with respect to solid state Cu ion interdiffusion. Theoretical and experimental analyses show that materials interactions responsible for blushing in conventionally-processed CMS (copper multilayer system) microcircuits degrade neither dielectric performance nor reliability. Microcircuit dielectrics metallized by Cu compare favorably to noble metal systems including gold, an accepted military standard. CMS dielectrics exhibit high activation barriers for ionic conductivity, and an absence of shorting due to solid state diffusion during high temperature/ high bias testing.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 145
Copyright
Copyright © Materials Research Society 1986

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