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Cu concentration dependence of the mechanical behaviour of Al-Cu alloys

Published online by Cambridge University Press:  10 February 2011

J. P. Lokker ,
R. S. A. van Winden ,
A. M. Janssen  and
S. Radelaar
J. P. Lokker
Affiliation:
DIMES Nano Physics and Technology, Delft University of Technology, P.O. Box 5046 2600 GA Delft, The Netherlands, lokker@dimes.tudelft.nl
R. S. A. van Winden
Affiliation:
DIMES Nano Physics and Technology, Delft University of Technology, P.O. Box 5046 2600 GA Delft, The Netherlands, lokker@dimes.tudelft.nl
A. M. Janssen
Affiliation:
DIMES Nano Physics and Technology, Delft University of Technology, P.O. Box 5046 2600 GA Delft, The Netherlands, lokker@dimes.tudelft.nl
S. Radelaar
Affiliation:
Netherlands Institute of Metal Research (NIMR) Rotterdamseweg 137, 2628 AL Delft, The Netherlands, lokker@dimes.tudelft.nl
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Abstract

This paper reports on the influence of the copper concentration on the mechanical behaviour during thermal cycling and during isothermal holds of Al-Cu thin films on Si substrates. The Cu concentration has been varied in the range between 0 to 1 at.%

Upon heating, the films with the larger amount of Cu showed a clear maximum in compressive stress. Moreover, during cooling these samples show a tensile stress increase at the onset precipitation temperature. Further cooling below 200 °C leads to the characteristic tensile stress increase often observed for Al-Cu thin films. An isothermal hold during cooling at 250 °C leads to temporary strengthening of all Al-Cu. The extent of the strengthening is dependent on the Cu concentration and is clearly dependent on the duration of the isothermal hold. Upon further cooling the strengthening disappears and the stress develops according to the original stress temperature dependence. The observations are discussed in terms of solid solution hardening and precipitation hardening.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999 , 477
Copyright
Copyright © Materials Research Society 1999

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