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CW Laser-Induced Removal of Interconnections in Submicron Devices

Published online by Cambridge University Press:  25 February 2011

Geoffroy Auvert*
Affiliation:
France Telecom CNET BP98-F 38243 Meylan France.
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Abstract

The interaction of a cw argon-ion laser with the materials used in the microelectronics technology is described as a pyrolytic effect. A chemical reaction is induced between the oxide layer and the hot irradiated silicon or aluminum line. By making a cross section of the irradiated area using a focused ion beam, the formation of an unstable insulating material covering the conducting material is observed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

1 Lax, M., J. Appl Phys. 48, 3919 (1977).Google Scholar
2 Lax, M., J. Appl Phys. 33, 786 (1978).Google Scholar
3 Liu, Y. S., in “Laser Microfabrication” Ed. by Ehrlich, D. J., Tsao, J. Y. Academic Press, San Diego (1989).Google Scholar
4 Nikawa, K., Nasu, K. et al., in 27th annual proceeding of the 1989 International Reliability Physics Symposium, p. 43.Google Scholar
5 Tonneau, D., Pauleau, Y., Auvert, G., Journal de Physique, C5637-T50 (1989).Google Scholar
6 Auvert, G., In “Reduced Thermal Processing for ULSI” Ed. by Levy, R. A., NATO ASI, Plenum Publishing Corp. p. 227 (1989).Google Scholar