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Direct Writing and Lift-Off Patterning of Copper Lines at 200°C Maximum Process Temperature
Published online by Cambridge University Press: 10 February 2011
Abstract
We adapted a new technique for depositing copper lines, at a maximum process temperature of 200°C. The technique is based on the decomposition of copper hexanoate by UV light, followed by annealing in H2 [1]. A copper film resistivity of 8 μΩcm is obtained. We patterned this copper metallization on Corning 7059 glass substrates by three different techniques, including exposure through a shadow mask, lift-off of xerographic toner, and direct writing.
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- Copyright © Materials Research Society 1997
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