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Effect of CMP Pad Exposure to Aqueous Media on the Pad Properties. Part 1. Dynamic Mechanical and Modulated DSC Analysis

Published online by Cambridge University Press:  01 February 2011

A. Tregub
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
M. Moinpour
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
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Abstract

Soaking of polyurethane-based CMP pad in oxide slurry, de-ionized water, and pH buffer solution, and its effect on thermal and mechanical properties of the pads was studied using Dynamic Mechanical Analysis and Modulated Differential Scanning Calorimetry. Pad softening due to soaking was established, and softening mechanisms are discussed. Diffusion of the aqueous medias to polyurethane pad was described using Fickian diffusion model.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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