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Effect of High Temperature Stress on Titanium-Tungsten Gold thin Films on Alumina
Published online by Cambridge University Press: 22 February 2011
Abstract
The adhesion of a sputtered titanium-tungsten gold (Ti-W/Au) thin film on alumina substrates is found to be weakened after being stressed at temperatures above 575°C, due to depletion of the Ti-W base metal. Thin films deposited on substrates having a fine grain structure and as fired surfaces, however, maintained their adherence at temperatures up to 650°C.
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- Copyright © Materials Research Society 1992