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Electrical Characterization of Slurry Particles and their Interactions with Wafer Surfaces

Published online by Cambridge University Press:  10 February 2011

Jin-Goo Park ,
Sang-Ho Lee  and
Hyoung-Gyun Kim
Jin-Goo Park
Affiliation:
Department of Metallurgy and Materials Engineering, Hanyang University, Ansan, 425–791, Korea; Hea-Do Jeong, Department of Mechanical Engineering, Pusan National University, Pusan, 609–735, Korea; Doo-Kyung Moon, Hanwha Group R–345, Korea
Sang-Ho Lee
Affiliation:
Department of Metallurgy and Materials Engineering, Hanyang University, Ansan, 425–791, Korea; Hea-Do Jeong, Department of Mechanical Engineering, Pusan National University, Pusan, 609–735, Korea; Doo-Kyung Moon, Hanwha Group R–345, Korea
Hyoung-Gyun Kim
Affiliation:
Department of Metallurgy and Materials Engineering, Hanyang University, Ansan, 425–791, Korea; Hea-Do Jeong, Department of Mechanical Engineering, Pusan National University, Pusan, 609–735, Korea; Doo-Kyung Moon, Hanwha Group R–345, Korea
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Abstract

The purpose of this study was to explore the interaction between slurry particles and wafer surfaces by the measurements of their zeta potentials. The zeta potentials of slurry particles such as fumed and colloidal silica, alumina, ceria and MnO2 and substrates such as silicon, TEOS, W, and Al have been measured by electrophoretic and electroosmosis method to evaluate the electrical properties of surfaces, respectively. The zeta potential of oxide and metal surfaces showed similar values to those of particles as a function of pH. The interaction energy between alumina and silica particles and TEOS, W and Al substrate were calculated based on DLVO theory. No deposition of silica particles on TEOS and the heavy deposition of alumina particles on metal substrates were observed in the particle deposition test. Experimental results were well agreed with the theoretical calculation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 173
Copyright
Copyright © Materials Research Society 2000

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References

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