Article contents
Engineering of PECVD Systems for Macroelectronic Applications
Published online by Cambridge University Press: 21 February 2011
Abstract
The materials quality (uniformity and homogeneity) produced by PECVD technique depends on the plasma behaviour. Problems related to the gas dissociation ratio and powder formation are responsible for materials costs and the appearance of voids. In this paper, we present data concerning the role of the plasma and reactor design, on the deposition conditions, suggesting ways to improve them for large area device (macroelectronics) applications.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1992
References
REFERENCES
- 1
- Cited by