Hostname: page-component-77c89778f8-n9wrp Total loading time: 0 Render date: 2024-07-20T16:24:38.602Z Has data issue: false hasContentIssue false

Epitaxial Si1-xGex Films and Superlattice Structures Grown by CVD for Infrared Photodetectors

Published online by Cambridge University Press:  10 February 2011

L. Maddiona
Affiliation:
Si-optoelectronics&post Silicon Technologies, Corporate R&D, ST Microelectronics, Catania, Italy
S. Coffa
Affiliation:
Si-optoelectronics&post Silicon Technologies, Corporate R&D, ST Microelectronics, Catania, Italy
S. Lorenti
Affiliation:
DSG R&D, STMicroelectronics, Catania, Italy
C. Bongiorno
Affiliation:
Dipartimento di Scienze Chimiche, Università di Catania, Catania, Italy
Get access

Abstract

Integration of photodetectors with high responsitivity in the near infrared (1.3-1.55 μm) on standard Si electronic circuits is important for a variety of applications in the field of on-chip, local area and long haul optical communications. In this work we report on a detailed structural and optical characterization of epitaxial Si1-xGex films and Si1-xGex /Si multilayers grown by chemical vapor deposition on (100) Si wafers. Cross-sectional transmission electron microscopy analyses show that metastable strained Si1-xGex films of few nanometer with x>40% can be deposited at low growth temperature and pressure. Absorption measurements on these films demonstrate the extension of the photo-response to 1.55 μm. Using these films as active layers Schottky integrated photodetectors have been fabricated.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Bose, D. N. in Perspectives in Optoelectronics, Edited by Jha, S. S., Chapter 6, pag. 299381, Word Scientific, New Jersey) 1995)Google Scholar
[2] Naval, L., Jalali, B., Gomelsky, L., Liu, J. M., Journal of Lightwave Technology 14, 787 (1996)Google Scholar
[3] Bean, J. C., Proceedings of IEEE, 80, 571 (1992)Google Scholar
[4] Vonsovici, A., Vescan, L., Apetz, R., Koster, A., Schmidt, K., IEEE Trans. on Electron Devices, 45, 538 (1998)Google Scholar
[5] Harame, D. L., Confort, J.H., Cressler, J. D., Crabbè, E. F., Sun, J.Y.C, Meyerson, B. S., IEEE Trans. on Electron Devices, 42, 469 (1995)Google Scholar