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Evaluation of Residual Stresses in Thin Films by Means of Micro-Raman Spectroscopy

Published online by Cambridge University Press:  10 February 2011

Kazuyuki Mizuhara
Affiliation:
Mechanical Engineering Laboratory, Tsukuba, 305 JAPAN, mizuhara@mel.gp.jp
Shinichi Takahashi
Affiliation:
Nikon Corp., Tsukuba Research Lab., Tsukuba, 305 JAPAN, shin@tsukubagw.nikon.co.jp
Jyunichi Kurokawa
Affiliation:
Chiba Univ., Chiba, 263 JAPAN
Noboru Morita
Affiliation:
Chiba Univ., Chiba, 263 JAPAN
Yoshitaro Yoshida
Affiliation:
Chiba Univ., Chiba, 263 JAPAN
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Abstract

The effects of temperatures on the stress evaluation of boron doped silicon in solid and film forms are investigated. Several techniques, such as fluid cooling to eliminate the temperature raise and/or simultaneous observation of Stokes and anti Stokes peaks to compensate the temperature effects, are applied. The advantages and disadvantages of each method and the abilities and limits of these techniques are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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