Hostname: page-component-84b7d79bbc-fnpn6 Total loading time: 0 Render date: 2024-07-29T23:20:48.923Z Has data issue: false hasContentIssue false
  • English
  • Français

Evolution of Residual Stresses in Thin Films Deposited on Mechanically Strained Substrates

Published online by Cambridge University Press:  25 February 2011

G. Sheikh ,
A. Berger  and
I. C. Noyan
G. Sheikh
Affiliation:
Now atColumbia University, Department of Metallurgical and Mining Engineering, New York, NY
A. Berger
Affiliation:
Now atHarvard University, Department of Physics, Cambridge, MA
I. C. Noyan
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY
Get access

Abstract

A simple model for the formation of residual stresses in thin films deposited on elastically strained substrates was derived and experimentally tested. In the experiments, Cu thin films were deposited on elastically stretched nickel substrates. These Cu films were2 to 4.m thick and were deposited through vapor phase evaporation or electroplating. The loads applied during the deposition were then relaxed, and the total stress in both the film and the substrate were monitored (by x-ray diffraction) during this relaxation. It was seen that the final (residual) film stresses were significantly different for bothdeposition methods. The causes of such differences are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 153
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Stoney, G. G., Proc. Roy. Soc. London, A 82. 172 (1909).Google Scholar
2. Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., Smith, D. A. (Mater. Res. Soc. Proc. 130, Pittsburgh, PA 1989)Google Scholar
3. D'Heurle, F. M., Harper, J. M. E., Thin Solid Films 171, 81 (1989)Google Scholar
4. D'Heurle, F. M., International Materials Reviews, 34, 53, (1989).Google Scholar
5. Weil, R., Plating and Surface Finishing, 69, 40 (1982)Google Scholar
6. Gardner, D. S., Flinn, P. A. in Thin Films: Stresses and Mechanic al Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., Smith, D. A. (Mater. Res. Soc. Proc. 130, Pittsburgh, PA 1989) pp. 69–76 Google Scholar
7. Noyan, I. C., Goldsmith, C. C., Adv. in X-ray Analysis, (in print).Google Scholar
8. Nilson, A. H. and Winter, G., Design of Concrete Structures, (McGraw-Hill, New York, 1986).Google Scholar
9. Noyan, I. C. and Cohen, J. B., Residual Stress, Measurement by Diffraction and Interpretation, Springer, New York (1987).Google Scholar