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Excimer Laser-Induced Decomposition of Aluminum Nitride

Published online by Cambridge University Press:  25 February 2011

H. Esrom ,
J-Y Zhang  and
A.J. Pedraza
H. Esrom
Affiliation:
Asea Brown Boveri AG, Corporate Research, W-6900 Heidelberg, Germany
J-Y Zhang
Affiliation:
Asea Brown Boveri AG, Corporate Research, W-6900 Heidelberg, Germany
A.J. Pedraza
Affiliation:
Department of Materials Science and Engineering, The University of Tennessee, Knoxville, TN 37996-2200, USA
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Abstract

A thin film of aluminum, detected by x-ray photoelectron spectroscopy, is left at the surface of aluminum nitride (AIN) substrates exposed to a high intensity excimer laser beam of UV radiation. Due to the presence of this film, there is a decrease in the surface resistivity of the substrate with increasing number of laser pulses. In addition, line profilometry shows a decrease of the surface roughness with the number of pulses.

The thermal decomposition of AIN is assumed to take place in two stages. In the first, liquid aluminum is produced together with the evolution of gaseous nitrogen, and in the second, aluminum evaporates. Using a computer model to simulate the laser heating cycle, it is shown that the thickness of the aluminum film saturates at a given laser energy density. The saturation thickness is a strong function of the substrate absorption and reflectivity and, therefore, of the laser light frequency. The influence of the substrate roughness on the electrical resistivity of the aluminum film is discussed.

The application of this process to direct laser writing in high density hybrid circuits is illustrated. During hole drilling by excimer laser, a thin aluminum film is continuously produced at the hole walls. This process can also be employed for substrate planarization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 236: Symposium B – Photons and Low Energy Particles in Surface Processing , 1991 , 383
Copyright
Copyright © Materials Research Society 1992

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