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Experimental Investigation on Interfacial Adhesion in Microelectronic Assemblies

Published online by Cambridge University Press:  10 February 2011

Xiang Dai ,
Mark V. Brillhart  and
Paul S. Ho
Xiang Dai
Affiliation:
University of Texas, Lab for Interconnect and Packaging, PRC/MER, MC R8650, Austin, Texas 78712
Mark V. Brillhart
Affiliation:
Hewlett-Packard Co., Electronic Assembly Development Center, 1501 Page Mill Road, MS 5L-3, Palo Alto, CA 94304
Paul S. Ho
Affiliation:
University of Texas, Lab for Interconnect and Packaging, PRC/MER, MC R8650, Austin, Texas 78712
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Abstract

In this paper, we report recent studies on interface adhesion in flip-chip packaging. The adhesion energies of underfill interfaces found in typical flip-chip packaging pplications are characterized and presented using a racture-mechanics approach. The effects of underfill formulations and changes in polymer top-layer on PCB and chip passivation are also evaluated. The effects of underfill organosilane content, ubstrate surface chemistry and morphology, and underfill filler content are discussed in terms of fundamental mechanisms of adhesion.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 15
Copyright
Copyright © Materials Research Society 1998

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References

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