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Fast Curing Epoxy and Episulfide Resins for Biomedical Applications

Published online by Cambridge University Press:  26 February 2011

Ioannis N. Hadjinikolaou
Affiliation:
University of Connecticut, Institute of Materials Science, Storrs, CT 06268
James P. Bell
Affiliation:
University of Connecticut, Institute of Materials Science, Storrs, CT 06268
Larz Spangberg
Affiliation:
University of Connecticut, Health Center, Department of Endodontics, Farmington, CT 06032
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Extract

Epoxy resins have physical properties that make them suitable for dental and orthopaedic applications such as adhesives and cements. However, it has been observed that epoxy resins harden too slowly for clinical use when mixed with conventional curing agents, e.g. amines and polyamides. A new epoxy - diepisulfide - polyamide system has been developed which gels in 5 to 20 minutes at room temperature. The system consists of two parts: a polyamide curing agent, and a blend of the diepisulfide analog of diglycidyl ether of bisphenol A [DGEBA] dissolved in a mixture of epoxies of the DGEBA type.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

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