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Flip-Chip Bump Bonding Reliability and Process Improvement

Published online by Cambridge University Press:  25 February 2011

Wei H. Koh ,
S. Mayemura  and
W. Kuipers
Wei H. Koh
Affiliation:
Grumman Space Systems Division, 2852 Kelvin Avenue., Irvine, CA 92714
S. Mayemura
Affiliation:
Grumman Space Systems Division, 2852 Kelvin Avenue., Irvine, CA 92714
W. Kuipers
Affiliation:
Grumman Space Systems Division, 2852 Kelvin Avenue., Irvine, CA 92714
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Abstract

Long term reliability of flip-chip bump bonding for application in infrared detector interconnection is investigated. The effectiveness of a thin film nickel as diffusion barrier for reducing indium-gold intermetallic formation is studied by accelerated life test and destructive physical analysis. A new interconnect structure replacing the conventional bump-to-bump configuration is described.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 437
Copyright
Copyright © Materials Research Society 1991

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References

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