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Formation of Subthreshold Defects in Erbium Implanted Silicon

Published online by Cambridge University Press:  10 February 2011

C. Flink
Affiliation:
Department of Material Science, University of California at Berkeley, CA, USA II. Physikalisches Institut der Universität zu Köln, Cologne, Germany
S. Mui
Affiliation:
Department of Material Science, University of California at Berkeley, CA, USA
H. Gottschalk
Affiliation:
II. Physikalisches Institut der Universität zu Köln, Cologne, Germany
J. Palm
Affiliation:
Siemens AG, Munich, Germany
E. R. Weber
Affiliation:
Department of Material Science, University of California at Berkeley, CA, USA
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Abstract

In this work we present the first quantitative approach to model subthreshold defects. Using cross-sectional Transmission Electron Microscopy (XTEM) and Convergent Beam Electron Diffraction (CBED), we studied subthreshold defects in Cz-silicon that followed a deep implantation of erbium, and their interaction with co-implantations. The analyzed Frank loops show an increasing size by a factor of five with increasing depth in the wafer. The ratios of the number of condensed silicon atoms to the implant doses support a “+0.4 model” for the erbium and a “+0.07 model” for the oxygen as a co-implant. Our results indicate that a “push away” mechanism produces the excess silicon atoms in the case of interstitial implant atoms. The observed loop size depth distributions helped to reveal the condensation mechanism of subthreshold defects. This mechanism is described by the relaxation of excess silicon atoms on primary defect clusters. The decreasing concentration profiles of the primary defect clusters together with the high diffusivity of silicon interstitials results in a number of condensed silicon atoms per loop that increases with the depth in the wafer.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Jones, K.S., Prussin, S. and Weber, E.R., Appl. Phys. A 45 1 (1988).Google Scholar
2. Sashan, K. and Washbum, J., Radiation Effects 37, 147 (1978).Google Scholar
3. Giles, M.D., J. Electrochem. Soc. 138, 1160 (1991).Google Scholar
4. Wahl, U., Vantomme, A., De Wachter, J., Moons, R., Langouche, G., Marques, J.G. and Correia, J.G., Physical Review Letters 79, 2069 (1997).Google Scholar
5. Shamura, F., in Oxygen in Silicon, Vol.42 of Semiconductors and Semimetals, edited by F., Shamura (Academic Press, San Diego, 1994), p. 2.Google Scholar
6. Eaglesham, D.J., Michel, J., Fitzgerald, E.A., Jacobson, D.C., Poate, J.M., Benton, J.L., Polman, A., Xie, Y.-H. and Kimerling, L.C., Appl. Phys. Letters 58, 2797 (1991).Google Scholar
7. Ren, F.Y.G., Michel, J., Sun-Paduano, G., Zheng, B., Kitagawa, H., Jacobson, D.C., Poate, J.M. and Kimerling, L.C., Mat. Res. Soc. Symp. Proc. 301, 87 (1993).Google Scholar
8. Tamura, M., Materials Science Reports 6, 141 (1991).Google Scholar
9. Duan, X., Palm, J., Zheng, B., Morse, M., Michel, J. and Kimerling, L.C., Mat. Res. Symp. Proc. 442, 249 (1997).Google Scholar
10. Kelly, P.M., Jostsons, A., Blake, R.G. and Napier, J.G., phys. stat. sol. (a) 31, 775 (1995).Google Scholar
11. Palm, J., Gan, F., Zheng, B., Michel, J., Kimerling, L.C., Phys. Rev. B 54, 17603 (1996).Google Scholar
12. Pan, G.Z., Tu, K.N., Prussin, A., J.Appl.Phys. 81, 78 (1997).Google Scholar
13. Bonafos, C., Mathiot, D. and Claverie, A., J.Appl.Phys. 6, 3008 (1998).Google Scholar
14. Ziegler, J.F., Biersack, J.P. and Littmark, U., Stopping and range of ions in solids (Pergamon Press, New York, 1985), 321 ff.Google Scholar
15. Caturla, M.-J., de la Rubia, T. Diaz, Jaraiz, M. and Gilmer, G.H., Mat. Res. Symp. Proc. 396 45 (1996).Google Scholar
16. Hu, S.M., Materials Science and Engineering 13, 102 (1994).Google Scholar