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GaAs Quantum Dots by MOCVD

Published online by Cambridge University Press:  28 February 2011

Takashi Fukui
Affiliation:
Research Center for Interface Quantum Electronics, Hokkaido University, N 13, W 8, Sappro 060, Japan
Seigo Ando
Affiliation:
Research Center for Interface Quantum Electronics, Hokkaido University, N 13, W 8, Sappro 060, Japan
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Abstract

New GaAs quantum dots called tetrahedral quantum dots (TQDs) were fabricated using selective area metalorganic chemical vapor deposition (MOCVD). GaAs sub-micron crystals were completely buried in AlGaAs with single growth run without any processing damage at heterojunction interface. The substrates were SiO2 masked (111)B GaAs, which are partially etched free of SiO2 over triangular area using electron beam lithograpy and reactive ion etching techniques. First, truncated tetrahedral AlGaAs buffer layers with {110} facet sidewalls were grown in triangular area. Next, GaAs TQDs were sequentially grown on the top of AlGaAs. Finally, AlGaAs layers were overgrown on the resulting tetrahedral structures. The shape of GaAs tetrahedron was measured by an atomic force microscope(AFM). The size of bottom triangle of GaAs TQDs were estimated to be 20 nm. The size fluctuation was about 2%, which means that uniformity of selective area growth is excellent. Photoluminescence of GaAs TQDs buried in AlGaAs was measured at 8.5K. A clear emission peak from GaAs TQDs was observed at 810 nm. The energy shift from the GaAs emission peak is 19meV, which agrees well with the calculation. The results suggest that the selective area MOCVD method is very promising to fabricate GaAs quantum dots.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

1. Arakawa, Y. and Sakaki, H., Appl. Phys. Lett. 40, 939(1982).Google Scholar
2. Sikorski, C. and Merkt, U.: Phys. Rev. Lett. 62, 2164(1989).Google Scholar
3. Reed, M.A., Randall, J.N., Aggarwal, R.J., Matyi, R.J., Moore, T.M., and Wetsel, A.E., Phys. Rev. Lett. 60, 535(1988).Google Scholar
4. Kash, K., Bhat, R., Mahoney, D.D., Lin, P.S.D., Scherer, A., Worlock, J.M., Van der Gaag, B.P., Koza, M., and Grabbe, P., Appl. Phys. Lett. 55, 681(1989).Google Scholar
5. Lamelle, F., Hu, P., Kubera, R., Robinson, W., Merz, J., and Petroff, P.M., J. Vac. Sci. & Technol. B7, 2034(1989).Google Scholar
6. Fukui, T., Ando, S., Tokura, Y., and Toriyama, T., Appl. Phys. Lett. 48, 2018(1991).Google Scholar
7. Fukui, T., Ando, S., Honda, T., and Toriyama, T., Surface Science 267, 236(1992).Google Scholar
8. Galeuchat, Y.D., Rothuizen, Hugo, and Roentgen, P., Appl. Phys. Lett. 58, 2423(1991).Google Scholar
9. Lebens, J.A., Tsai, C.S., Vahala, K.J., and Kuech, T.F., Appl. Phys. Lett. 56, 2642(1990).Google Scholar
10. Nagamune, Y., Tsukamoto, S., Nishioka, M., and Arakawa, Y., Ext. Abst. Int. Conf. Solid State Devices and Matter., p.689(Yokohama, 1991)Google Scholar
11. Watanabe, H., The Physics and Fabrication of Microstructures and Microdevices, p.158 (Springer, Heidelberg, 1986)Google Scholar