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Gettering & Precipitation Phenomena in Semiconductors

Published online by Cambridge University Press:  21 February 2011

D. K. Sadana*
Affiliation:
Philips Research Laboratories Sunnyvale Signetics Corporation 811 E. Arques Ave. Sunnyvale, CA 94086
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Abstract

Impurity gettering at defects/damage in Si is discussed. Details of intrinsic and extrinsic gettering in Si are presented. The utility of gettering is demonstrated by comparing the results from gettered and non-gettered test devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

1. Weber, E., App. Phys. A30 122 (1983), also this proceeding.Google Scholar
2. Kikuchi, M. and Iijima, S., Bulletin of the Electrochemical Laboratory, 21 22 (1957).Google Scholar
3. Mets, E.J., J. Electrochem. Soc. 112 420 (1965).10.1149/1.2423560CrossRefGoogle Scholar
4. Stacy, W.T., Arst, M.C., Ritz, K.N., Groot, J. G. de and Norcott, M.H., Defects in Silicon Proc. Electrochem. Soc. 83–9 423 (1983) Eds: Bullis, W.M. and Kimerling, L.C..Google Scholar
5. Chen, M.C. and Silvestri, V.J., J. Electrochem. Soc. 129 1294 (1982).10.1149/1.2124121Google Scholar
6. Ludwig, G. W. and Woodbury, H.H., Solid State Phys. 13 223 (1962).10.1016/S0081-1947(08)60458-0Google Scholar
7. Trumbore, F.A., Bell Sys. Tech. J 39 205 (1960).10.1002/j.1538-7305.1960.tb03928.xGoogle Scholar
8. Bakhadyrkhanov, M.K., Boltaks, B.I and Kulikov, G.S., Soy. Phys. Solid State 12 144 (1970).Google Scholar
9. Ba-khadyrkhanov, M.K., Zainabidinov, S. and Khamidov, A., Soy. Phy. Solid State 14 412 (1980).Google Scholar
10. Hall, R.N. and Racette, c.H., J. AppI. Phys. 35 379 (1964).10.1063/1.1713322Google Scholar
11. Seeger, A., Frank, W. and Gosele, V., Inst. of Phys., London Conf. Ser. 46 148 (1979).Google Scholar
12. Lee, Y.H., Kleinhenz, R.L. and Corbett, J.W., Inst. of Phys., London Conf. Ser. 46 521 (1979).Google Scholar
13. Das, G., J. Appl. Phys. 44 4459 (1973).10.1063/1.1661982CrossRefGoogle Scholar
14. Nes, E. and Washburn, J., J. App. Phys. 42 3562 (1971); J. App. Phys. 43 2005 (1972), J. App. Phys., 44 3682 (1973).10.1063/1.1660771Google Scholar
15. Stacy, W.T., Allison, D.F. and Wu, T.C, J. Electrochem. Soc. 129 1128 (1982).10.1149/1.2124041Google Scholar
16. Lunnon, M., Allison, D. F. and Stacy, W.T., Defects in Silicon Proc. ECS. 83–9, 463 (1983), Eds: Bullis, W.M. and Kimerling, L.C..Google Scholar
17. Tice, W.K. and Tan, T.Y., Appl. Phys. Lett. 28 563 (1976).10.1063/1.88825Google Scholar
18. Ravi, K.W., Varker, C.J. and Volk, C.E., J. Electrochem. Soc. 120 534 (1973).Google Scholar
19. Ourmazd, A. and Booker, G.R., Phys. Stat. Sol. A55 771 (1979).10.1002/pssa.2210550249Google Scholar
20. Goetzberger, A. and Shockley, W., J. App. Phys. 31 1821 (1960).10.1063/1.1735455Google Scholar
21. Bemski, G., Phy. Rev. 103 567 (1956).10.1103/PhysRev.103.567CrossRefGoogle Scholar
22. Nakamura, M., Kato, T. and Oi, N., Jap. J: App. Phys. 7 512 (1968).Google Scholar
23. Geipel, H.c. and Tice, W.K., IBM J. Res. Develop. 24 310 (1980).10.1147/rd.243.0310Google Scholar
24. Seidel, T.E., Meek, R.L. and Cullis, A.G., J. App. Phys. 46 600 (1975).10.1063/1.321664Google Scholar
25. Yun, B.M., App. Phys. Lett. 39 330 1981.10.1063/1.92710Google Scholar
26. Topich, c.A., J. Electrochem. Soc. 124 865 (1981).Google Scholar
27. Sigmon, T. W., Csepregi, L. and Mayer, c.W., J. Electrochem. Soc. u123 1116 (1976).10.1149/1.2133007Google Scholar
28. Poponiak, M.R., Nagasaki, T. and Yen, Y.H., J. Electrochem. Soc. 124 1802 (1977).10.1149/1.2133159Google Scholar
29. Pomemrantz, D., J. App. Phys. 38 5020 (1976).10.1063/1.1709270Google Scholar
30. Rozgonyi, G.A., Petroff, P.M. and Read, M.H., J. Electrochem. Soc. 122 1725 (1975).10.1149/1.2134118CrossRefGoogle Scholar
31. Hsieh, C.M., Mathews, c.R., Seidel, T.D., Pickar, K.A. and Drum, C.M., App. Phys. Lett. 22 238 (1973).10.1063/1.1654624Google Scholar
32. Schwuttke, G.H., Yang, K. and Kappert, H., Phys. Status Solidi A42 553 (1977).10.1002/pssa.2210420218Google Scholar
33. Nassibian, A.G. and Grolija, B., J. App. Phys., 53 6168 (1982).10.1063/1.331528Google Scholar
34. Salih, A.S.M., Kim, H.c., Davis, R.F. and Rozgonyi, G.A., Semiconductor Processing ASTM STP Gupta, D.C. (ed), American Society for Testing and Materials 1984 (San Jose 1984); also this proceeding.Google Scholar
35. Augustus, P.D., same as ref. 4, p. 414.Google Scholar
36. Dahmen, U., Acta Met. 30 63 (1982).10.1016/0001-6160(82)90045-1Google Scholar
37. Nicolet, M-A. and Lau, S.S, VLSI Electronics: Microstructure Science Vol.6 (Eds: Einspruch, N. G. and Larrabee, G.B.) Academic Press 1983 pp.362.Google Scholar
38. Queisser, H.J., IRE Trans. ED-8 439 (1961).10.1109/T-ED.1961.14853Google Scholar
39. Iwai, H., Otsuka, H., Matsumato, Y., Hisatomi, K. and Aoki, K., IEEE ED–31, 1149 (1984).Google Scholar
40. Hayafuji, Y., Yanada, T. and Aoki, Y., J. Etectrochem Soc. 128 1975 (1981).10.1149/1.2127778Google Scholar
41. Pearce, C.W. and Zaleckas, V.J. J. Electrochem Soc. 126 1436 (1979).10.1149/1.2129298Google Scholar
42. Ourmazd, A., private communication.Google Scholar
43. Sadana, D.K., Washburn, c. and Booker, G.R., Phil Mag B47 611 (1982).10.1080/01418638208223548Google Scholar
44. Tan, T.Y., Gardner, E.E. and Tice, W.K., Appl. Phys. Lett. 30 175 (1977).10.1063/1.89340Google Scholar
45. Rozgonyi, G.A. and Pearce, C.W., App. Phys. Lett. 31 343 (1977).10.1063/1.89693Google Scholar
46. Rozgonyi, G.A. and Pearce, C.W., App. Phys. Lett. 32 747 (1978).10.1063/1.89908Google Scholar
47. Nagasawa, K., Matsushita, Y. and Kishino, S., App. Phys.Lett. 37 622 (1980).10.1063/1.91998Google Scholar
48. Matsushita, Y., Kishimo, S. and Kanamori, M., Jap. 3. App. Phys. 19 LI01 (1980).Google Scholar
49. Shimura, F., Tsuya, H. and Kawamura, T., J. Electrochem Soc., 128 1579 (1981).10.1149/1.2127686Google Scholar
50. Tsuya, H., Ogawa, K. and Shimura, F., Jap. J. App. Phys. 20 L31 (1981).10.1143/JJAP.20.L31Google Scholar
51. Peibst, H. and Raidt, H., Phys. Stat. Solidi, A68 253 (1981).10.1002/pssa.2210680134Google Scholar
52. Ponce, F.A. and Yamashita, T., App. Phys. Lett. 43 1051 (1983).10.1063/1.94232Google Scholar
53. Huber, D. and Reffle, J., Solid State Tech. 26 137 (1983).Google Scholar
54. Tsui, R.K., Curless, c.A., d'Aragona, F. Secco and Tejes, P.L., J. Electrochem. Soc. 131 180 (1984).10.1149/1.2115503Google Scholar
55. Craven, R.A., this proceeding.Google Scholar
56. Borland, J.O., this proceeding.Google Scholar
57. Ourmazd, A. and Schroter, W., App. Phys. Lett. 45 781 (1984), also this proceeding.10.1063/1.95364Google Scholar
58. Paz, P., Hearn, E. and fayo, E., J. Electrochem. Soc. 126 1754 (1979).10.1149/1.2128791Google Scholar
59. Baldi, L., Cerofiloni, G. and Fesla, G., J. Electrochem. Soc. 127 164 (1980).10.1149/1.2129609Google Scholar