Hostname: page-component-7479d7b7d-k7p5g Total loading time: 0 Render date: 2024-07-11T14:48:35.204Z Has data issue: false hasContentIssue false

Hybrid Aerogel-MLI Insulation System Performance Studies for Cryogenic Storage in Space Applications

Published online by Cambridge University Press:  31 January 2011

R. Begag
Affiliation:
Aspen Aerogels, Inc., 30 Forbes Rd., Northborough, MA 01532, rbegag@aerogel.com
S. White
Affiliation:
Aspen Aerogels, Inc., 30 Forbes Rd., Northborough, MA 01532, rbegag@aerogel.com
J.E. Fesmire
Affiliation:
NASA Kennedy Space Center, Cryogenics Test Laboratory, KSC, FL 32899, james.e.fesmire@nasa.gov
W.L. Johnson
Affiliation:
NASA Kennedy Space Center, Cryogenics Test Laboratory, KSC, FL 32899, james.e.fesmire@nasa.gov
Get access

Abstract

Long duration storage of large quantities of cryogenic fluids for propulsion, power, and life-support is an essential requirement for missions into space. Efficient and reliable insulation materials are key to the success of these missions. The required insulation material must outperform the current standard multi-layer insulation (MLI) for thermal insulation and provide additional features such as durability, micrometeoroid orbital debris protection, and flexibility, all in one single-layer material. Ultra-low density and highly hydrophobic fiber reinforced aerogel material integrated with MLI has the potential to offer a great insulation package which will overcome several issues that the current standard MLI alone suffers from such as: 1) damage during installation, 2) high cost, and 3) degradation over time. The hybrid aerogel/MLI solution affords a more reliable alternative because it is robust, and will outperform the MLI in cases of vacuum loss. Low density and highly resilient methylsilicate aerogel will contribute less solid conductivity to the overall heat transfer within the aerogel/MLI system. Sol-gel optimization of low density and low dust methylsilicate aerogels will be presented. Thermal performance of two prototypes of hybrid aerogel/MLI composites and a baseline MLI system (1 inch thick, 90 layers) fabricated by Aerospace Fabrication and Materials (AFM) and tested at cryogenic temperatures under different vacuum level conditions (at Cryogenic Laboratory, NASA KSC) will also be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tomlinson, B. J., Davis, T. M., Ledbetter, J. D., “Advanced cryogenic integration and cooling technology for space-based long term cryogenic storage”, Cryocoolers, vol. 11. Kluwer Academic/ Plenum Publishers; 2001.Google Scholar
2. Kittel, P., Plachta, D., “Propellant preservation for mars missions”, Advances in cryogenic engineering, vol. 45. Kluwer Academic/ Plenum Publishers; 2000.Google Scholar
3. Plachta, D., Kittel, P., “An updated zero boil-off cryogenic propellant storage analysis applied to upper stages or depots in an LEO environmentNASA Glenn Research Center, NASA TM 2003–211691, June 2003.Google Scholar
4. Venkatswara, R., Nagaraja, D. H., and Hiroshima, H., J. Colloid. Interf. Sci., 2007, 305, 124.10.1016/j.jcis.2006.09.025Google Scholar
5. Fesmire, J. E., et al. , “Equipment and Methods for Cryogenic Thermal Insulation Testing,” in Advances in Cryogenic Engineering, Vol. 49, American Institute of Physics, New York, 2004, pp. 579586.Google Scholar
6. Fesmire, J. E., and Augustynowicz, S., “Thermal Insulation Testing Method and Apparatus,” US Patent 6,824,306 November 30, 2004.Google Scholar
7. Johnson, W. L., Demko, J. A., and Fesmire, J. E., “Analysis And Testing of Multilayer and Aerogel Insulation Configurations,” Advances in Cryogenic Engineering, Vol. 55A, American Institute of Physics, Melville, NY, 2010. Pg. 780787.Google Scholar
8. DOE Phase I, “Flexible Aerogel as a Superior Thermal Insulation for Superconductor Technology”, Contract No DE-FG02–08ER85189.Google Scholar