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In Situ Measurement of Stresses in Thin Films

Published online by Cambridge University Press:  22 February 2011

Reinhard Abermann
Reinhard Abermann*
Affiliation:
University of Innsbruck, Institute of Physical Chemistry, A-6020 Innsbruck, Austria.
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Abstract

In this paper the results of experiments are summarized in which the internal stress (i.e. force per unit width) of thin films was measured in situ under UHV conditions with a bending beam apparatus. It is demonstrated that characteristic types of stress vs. thickness curves can be correlated with different growth modes (i.e. columnar grain growth and island growth) caused by differences in the adatom mobility of the deposited material. With a selection of thin film systems it is then shown that stress measurements can be used to study the effect of gas incorporation, of gas diffusion from the substrate, of reaction with the substrate and of the substrate temperature on the growth and structure of a thin film. Finally it will be demonstrated that stress measurements can even be used to study gas adsorption on vapor deposited films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 25
Copyright
Copyright © Materials Research Society 1992

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References

[1] Abermann, R., Kramer, R. and Maser, J., Thin Solid Films 52, 215 (1978).CrossRefGoogle Scholar
[2] Koch, R., Leonhard, H., Thurner, G. and Abermann, R., Rev. Sci. Instrum. 61, 3859 (1990).CrossRefGoogle Scholar
[3] Klokholm, E. and Berry, B.S., J. Electrochem. Soc., 115, 823 (1968).CrossRefGoogle Scholar
[4] Chandhari, P., J. Vac. Sci. Technol., 9, 520 (1972).CrossRefGoogle Scholar
[5] Hoffman, R.W., Thin Solid Films, 34, 185 (1976).CrossRefGoogle Scholar
[6] Abermann, R. and Martinz, H.P., Thin Solid Films, 115, 185 (1984).CrossRefGoogle Scholar
[7] Abermann, R., Koch, R. and Martinz, H.P., Vacuum, 33, 871 (1983).CrossRefGoogle Scholar
[8] Thornton, J.A. and Hoffman, D.W., Thin Solid Films, 171, 5 (1989).CrossRefGoogle Scholar
[9] Winau, D., Koch, R., Fuhrmann, A. and Rieder, K.H., J. Appl. Phys. 70, 3081 (1991).CrossRefGoogle Scholar
[10] Thurner, G. and Abermann, R., Thin Solid Films, 192, 277 (1990).CrossRefGoogle Scholar
[11] Schneeweiβ, H.J. and Abermann, R., Vacuum, in press.Google Scholar
[12] Abermann, R., Thin Solid Films, 186, 233 (1990).CrossRefGoogle Scholar
[13] Koch, R. and Abermann, R., Thin Solid Films, 129, 71 (1985).CrossRefGoogle Scholar
[14] Koch, R. and Abermann, R., Thin Solid Films, 140, 217 (1986).CrossRefGoogle Scholar
[15] Thurner, G. and Abermann, R., J. Vac. Sci. Technol., A5, 1635 (1987)CrossRefGoogle Scholar