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Influence of Full-filled Polymer Molding on High-frequency Circuits

Published online by Cambridge University Press:  26 February 2011

Kiyoshi Nakanishi  and
Masayuki Fujimoto
Kiyoshi Nakanishi
Affiliation:
nakanishi.kiyoshi@jp.panasonic.com, Shizuoka University, Graduate School of Science and Technology, 3-5-1 Jyouhoku, Hamamatsu, 432-8561, Japan
Masayuki Fujimoto
Affiliation:
fujimoto@cjr.shizuoka.ac.jp, Shizuoka University, 3-5-1 Jyouhoku, Hamamatsu, 432-8561, Japan
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Abstract

The influence of full-filled polymer molding on high-frequency circuits in cellular phones is evaluated using computer simulations and high-frequency measurements. Polymer-molded high-frequency circuits of cellular phones increase radiation harmonics and line and antenna phase errors. High-frequency properties are degraded due to a decrease in line impedance and an increase in stray capacitance of land electrodes that are used in the assembly of components. Degradation problems caused by full-filled polymer molding can be alleviated by appropriate circuit design, such as by adjusting the distance of components and creating more effective electromagnetic shielding. Better circuit design must satisfy the specifications of several different types of cellular phones, including global systems mobile telecommunications and digital cellular systems.

Keywords

polymercompositeceramic
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 969: Symposium W – Heterogeneous Integration of Materials for Passive Components and Smart Systems , 2006 , 0969-W01-05
Copyright
Copyright © Materials Research Society 2007

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