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Low Thermal Conductivity and Related Thermoelectric Properties of Zn4Sb3 and CoSb3 Thin Films

Published online by Cambridge University Press:  01 February 2011

Kazuhiro Ito ,
Lanting Zhang ,
Katsuyuki Adachi  and
Masaharu Yamaguchi
Kazuhiro Ito
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606–8501, Japan
Lanting Zhang
Affiliation:
Currently with School of Material Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200030, P.R. China
Katsuyuki Adachi
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606–8501, Japan
Masaharu Yamaguchi
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606–8501, Japan
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Abstract

Thermal conductivity and other thermoelectric properties were investigated on β-Zn4Sb3 and CoSb3 thin films. They are prepared by co-deposition of the specific sets of Zn, Sb and Co targets by RF magnetron sputtering. Thermal conductivity measurement was performed based on an AC calorimetry method using LaserPIT. The Zn4Sb3 thin films investigated are Zn-rich with respect to the stoichiometric composition. Their thermal conductivity decrement is proportional to the reciprocal film thickness. A nano-scale grain size in a ∼350 nm-thick film specimen gives arise to an almost 50% reduction in its thermal conductivity (∼0.5W/mK) at room temperature. Low electrical resistivity and high Seebeck coefficient can be achieved simultaneously in the film specimen with properly controlled thickness and microstructure. A ZT of 1.2 at ∼460K has been obtained for the ∼350nm thick Zn4Sb3 film specimen. The minimum thermal conductivity of about 1.1 W/mK was obtained in a ∼325 nm-thick CoSb3 film specimen at room temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 793: Symposium S – Thermoelectric Materials 2003 - Research and Applications , 2003 , S5.1
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Song, D.W., Liu, W.L., Zeng, T., Borca-Tasciuc, T., Chen, G., Caylor, J.C., and Sands, T.D., Applied Physics Letters 77, 3854 (2000).Google Scholar
2. Chen, G., in “Recent trends in thermoelectric materials research III,” Semiconductors and semimetals vol. 71, edited by Tritt, T.M. (Academic Press, San Diego, 2001) pp. 203.Google Scholar
3. Dresselhaus, M.S., Lin, Y.-M., Koga, T., Cronin, S.B., Rabin, O., Black, M.R., and Dresselhaus, G., in “Recent trends in thermoelectric materials research III,” Semiconductors and semimetals vol. 71, edited by Tritt, T.M. (Academic Press, San Diego, 2001) p. 1.Google Scholar
4. Broido, D.A. and Reinecke, T.L., in “Recent trends in thermoelectric materials research III,” Semiconductors and semimetals vol. 71, edited by Tritt, T.M. (Academic Press, San Diego, 2001) p. 123.Google Scholar
5. Venkatasubramanian, R., Slivola, E., Colpitts, T., and O'Quinn, B., Nature 413, 597 (2001).Google Scholar
6. Caillat, T., Fleurial, J.-P., and Borshchevsky, A., J. Phys. Chem. Solids, 58, 1119 (1997).Google Scholar
7. Koyanagi, T., Matsubara, K., Adachi, K. and Kishimoto, K., in Proc. 12th Int. Conf. Thermoelectrics, (Yokohama, Japan, 1994) pp. 340.Google Scholar
8. Zhang, L.T., Tsutsui, M., Ito, K. and Yamaguchi, M., Thin Solid Films, 443, 84 (2003).Google Scholar
9. Kato, R., Maesono, A., and Hatta, I., Jpn. J. Appl. Phys., 32, 3656 (1993).Google Scholar
10. Takahashi, F., Hamada, Y., and Hatta, I., Jpn. J. Appl. Phys., 38, 5278 (1999).Google Scholar
11. Hatta, I., Fujii, K., and Kim, S.-W., Mater. Sci. Eng., A 292, 189 (2000).Google Scholar
12. Cahill, D.G., Watson, S.K., and Pohl, R.O., Phys. Rev. B46, 6131 (1992).Google Scholar
13. Zhang, L.T., Tsutsui, M., Ito, K. and Yamaguchi, M., J. Alloys Comp., 358, 252 (2003).Google Scholar
14. Koyanagi, T., Hino, K., Yagamoto, Y., Yoshitake, H. and Kishimoto, K., in Prof. 16th Int. Conf. Thermoelectics, (Dresden, Germany, 1997) pp. 463.Google Scholar