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Material Science and the Electronic Packaging Roadmap

Published online by Cambridge University Press:  21 February 2011

C. A. Steidel ,
R. C. Sundahl  and
N. Grayeli
C. A. Steidel
Affiliation:
Kulicke and Soffa Industries, Inc.
R. C. Sundahl
Affiliation:
Intel Corp.
N. Grayeli
Affiliation:
Intel Corp.
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Extract

The National Technology Roadmap forecasts significant increases in performance for silicon devices over the next several years continuing the pace of the last 25 years. As the complexity and performance of the silicon have increased, so has the cost to manufacture the supporting packages. However, continued growth of the industry demands that package costs be held under control. A requirement of the Roadmap is a need for a significant lowering of cost over the period. On a per lead basis: for example, for cost/performance products in 1995 the range in per pin cost is 1.4–8 cents. These costs must move to 1–3 cents per lead over the next 15 years, while lead count increases from a few hundred to a few thousand. These costs will not be achievable unless we change how materials are developed and deployed to the market.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 3
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, Ca (1994).Google Scholar
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