Hostname: page-component-5c6d5d7d68-txr5j Total loading time: 0 Render date: 2024-08-18T07:18:22.519Z Has data issue: false hasContentIssue false

Materials and Device Characteristics of Pseudomorphic AlGaAs-InGaAs-GaAs and AlInAs-InGaAs-InP High Electron Mobility Transistors

Published online by Cambridge University Press:  28 February 2011

J.M. Ballingall
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
Pin Ho
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
G J. Tessmer
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
P.A. Martin
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
T.H. Yu
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
P.C. Chao
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
P.M. Smith
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
K.H.G. Duh
Affiliation:
THE GE COMPANY ELECTRONICS LABORATORY SYRACUSE, NY 13221 (INVITED).
Get access

Abstract

High electron mobility transistors (HEMTs) with single quantum well active layers composed of pseudomorphic IπGaAs grown on GaAs and InP are establishing new standards of performance for microwave and millimeter wave applications. This is due to recent progress in the molecular beam epitaxial growth of strained InGaAs heterostructures coupled with developments in short gate length (sub%0.2 µm) device fabrication technology. This paper reviews this progress and the current state-of-the-art for materials and devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Mimura, T., Hiyamizu, S., Fujii, T., and Nanbu, K., J.J. Appl. Phys. 19,2225 (1980).Google Scholar
2Duh, K.H.G. and Craig-Adams, B., submitted for publication in Microwave Journal.Google Scholar
3Masselink, W.T., Klem, J., Henderson, T., Ketterson, A., Gedymin, J.S., Morkoc, H., and Gleason, K.R., IEEEI IEDM Tech. Digest IEDM–85,755 (1985).Google Scholar
4Henderson, T., Aksun, M., Peng, C., Morkoc, H., Chao, P.C., Smith, P., Duh, K., and Lester, L., IEEE Electron Device Lett. EDL–7,645 (1986).Google Scholar
5Ho, P., Chao, P.C., Duh, K.H.G., Jabra, A., Ballingall, J.M., and Smith, P.M., IEEE/IEDM Tech. Digest IEDM–88,184 (1988).Google Scholar
6Mishra, U.K., Brown, A.S., Rosenbaum, S.E., Delaney, M J., Vaughn, S., and White, K., presented at the 46th Device Research Conference, Boulder, CO (June 1988).Google Scholar
7Nag, B.R., Ahmed, S.R., and Deb Roy, M., IEEE Trans. Electron Devices 33,788 (1986).Google Scholar
8Liu, C.T., Lin, S.Y., Tsui, D.C., Lee, H., and Ackley, D., Appl. Phys. Lett. 53,2510 (1988).Google Scholar
9Hong, W.P., Ng, G.I., Bhattacharya, P.K., Pavlidis, D., Willing, S., and Das, B., J. Appl. Phys. 64,1945 (1988).Google Scholar
10Foisy, M.C., Tasker, P.J., Hughes, B., ad Eastman, L.F., IEEE Trans. Electron Devices 35, 871 (1988).Google Scholar
11Moll, N., Hueschen, M.R., and Fischer-Colbrie, A., IEEE Trans. Electron Devices 35,879 (1988).Google Scholar
12Lee, B.R., Tessmer, G.J., Martin, P.A., Yu, T.H., and Ballingall, J.M., presented at the 1987 Electronic Materials Conference, Santa Barbara, CA (June 1987).Google Scholar
13Lyo, S.K. ad Jones, E.D., Phys. Rev. B 38,4113 (1988).Google Scholar
14Peercy, P.S., Dodson, B.W., Tsao, J.Y., Jones, E.D., Meyers, D.R., Zipperian, T.E., Dawson, L.R., Biefeld, R.M., Klem, J.F., and Hills, C.R., IEEE Electron Device Lett. EDL–9,621 (1988).Google Scholar
15Whaley, G J. and Cohen, P.I., J. Vac. Sci. Technol. B6,625 (1988).Google Scholar
16Radulescu, D.C., Schaff, W.J., Eastman, L.F., Ballingall, J.M., Ramseyer, G.O., and Hersee, S.D., J. Vac. Sci. Technol. B7, 111 (1989).Google Scholar
17Lewis, B.F., Lee, T.C., Grunthaner, F.J., Maserjian, A., J. Vac. Sci. Technol. B2,419 (1984).Google Scholar
18Berger, P.R., Chang, K., Bhattacharya, P.K., and Singh, J., J. Vac. Sci. Technol. B5,1162 (1987).Google Scholar
19Fischer-Colbrie, A., Miller, J.N., Laderman, S.S., Rosner, S.J., and Hull, R., J. Vac. Sci. Technol. B6,620(1988).Google Scholar
20Ballingall, J.M., Ho, P., Tessmer, G J., Martin, P.A., Lewis, N. and Hall, E.L., Appl. Phys. Lett. 54,2121 (1989).Google Scholar
21Ballingall, J.M., Ho, P., Martin, P.A., Tessmer, G.J., Yu, T., Lewis, N., and Hall, E.L., presented at the Electronic Materials Conference, Cambridge, MA (June 1989), to be published in the Journal of Electronic Materials.Google Scholar
22Swanson, A.W., Microwaves andRF 26,139 (1987).Google Scholar
23Smith, P., Lester, L., Chao, P.C., Lee, B.R., Smith, R.P., Ballingall, J.M., and Duh, K.H.G., IEEE/IEDM Tech. Digest IEDM–87, 854 (1987).Google Scholar
24Smith, P.M., Kao, M.Y., Ho, P., Chao, P.C., Duh, K.H.G., Jabra, A.A., Smith, R.P., Ballingall, J.M., IEEE MTT-S Digest, 983 (1989); IEEE Electron Device Lett. EDL-10,580 (1989).Google Scholar
25Kim, B., Wurtele, M., Shih, H.D., and Tserng, H.Q., IEEE Electron Device Lett. EDL–9,57 (1988).Google Scholar
26Kim, B., Matyi, R.J., Wurtele, M., Bradshaw, K., and Tserng, H.Q., IEEE/IEDM Tech. Digest IEDM–88,168 (1988).Google Scholar
27Kushner, L.J., Hollis, M.A., Matthews, R.H., Nichols, K.B., and Bozler, C.O., IEEE MTT-S Digest, 525 (1988).Google Scholar
28Higgins, J. A., GaAs IC Symposium Digest, 33 (1988).Google Scholar
29Smith, P.M., Chao, P.C., Lester, L.F., Smith, R.P., Lee, B.R., Ferguston, D.W., Jabra, A.A., Ballingall, J.M., and Duh, K.H.G., IEEE MTT-S Digest, 927 (1988).Google Scholar
30Smith, P.M., Lester, L.F., Ferguson, D.W., Chao, P.C., Ho, P., Kao, M.Y., Ballingall, J.M., Smith, R.P., Electronics Letters 25,639 (1989).Google Scholar
31Fukui, H., IEEE Trans. Microwave Theory and Tech, MTT–27,643 (1979).Google Scholar
32Chao, P.C., Smith, P.M., Duh, K.H.G., and Ballingall, J.M., Extended Abstracts of 21st Conference on Solid State Devices and Materials, Tokyo, p. 277 (1989).Google Scholar
33Swanson, A.W., Smith, P.M., Chao, P.C.Duh, K.H.G., and Ballingall, J.M., IEEE MILCOM Conference Proceedings, p. 0744 (October 1989).Google Scholar
34Chao, P.C., Ho, P., Duh, K.H.G., Smith, P., Ballingall, J.M., Jabra, A.A., Lewis, N., and Hall, E.L., submitted for publication in Electronics Letters.Google Scholar
35Chao, P.C., Tessmer, A., Duh, K.H.G., Ho, P., Kao, M., Smith, P., Ballingall, J., Liu, S., and Jabra, A., to be published in IEEE Electron Device Lett. (January 1990).Google Scholar
36Mishra, U.K., Brown, A.S., and Rosenbaum, E., IEEE/IEDM Tech. Digest IEDM–88,180 (1988).Google Scholar