Flip chip interconnect systems are becoming increasingly popular in the electronics industry due to their low profile and high densities. During temperature cycles, the differential expansions between various assembly members of a flip chip interconnect system produce mechanical stresses that are the driving force for failures. Such failures can be a significant reliability concern.

Accelerated test methodologies for flip chip interconnect systems assess the reliability of existing interconnects and identify potential reliability concerns in future interconnect designs. Traditionally, such methodologies have relied on test methods such as temperature cycling to determine the mechanical integrity of the flip chip interconnect. However, application of such methods to new interconnect materials, geometry and processes requires characterization of basicmechanical behavior of the interconnect system.

In this work, the feasibility of using a micromechanical test methodology for flip chip applications is examined. 90PbSn solders is used as an example. The data obtained from such flip chip solder interconnects is validated using a damage integral methodology. The measured data is shown to adequately describe published thermal stress profiles and thermal fatigue life data measured using solder joints of the same composition. Finally, some considerations in the application of micromechanical measurements to determination of acceleration factors and development of accelerated test methods are discussed.