Article contents
The Mechanism of Low pH Colloidal Silica-based Oxide Slurries
Published online by Cambridge University Press: 01 February 2011
Abstract
The mechanism of oxide polishing at low pH in the presence of an organic cation is discussed. The role of the cation is thought to involve increasing the nucleophilicity of the silanolate active site on the particle surface by lowering the hydration state. Additionally, the activation energy of the reaction may be lowered by charge attraction between the particle and wafer surface and by increased hydrophobic interactions.
Keywords
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 2010
References
- 3
- Cited by