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Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Douglas Gauthier ,
Andrew Mueller ,
Robert David White ,
Vincent Manno ,
Chris Rogers ,
Donald Hooper ,
Sriram Anjur  and
Mansour Moinpour
Douglas Gauthier
Affiliation:
douglas.gauthier@tufts.edu, Tufts University, Medford, MA, 02155, United States
Andrew Mueller
Affiliation:
amueller@draper.com, Tufts University, Medford, MA, 02155, United States
Robert David White
Affiliation:
r.white@tufts.edu, Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Vincent Manno
Affiliation:
vincent.manno@tufts.edu, Tufts University, Medford, MA, 02155, United States
Chris Rogers
Affiliation:
crogers@tufts.edu, Tufts University, Medford, MA, 02155, United States
Donald Hooper
Affiliation:
don.fab11.hooper@intel.com, Intel Corporation, Santa Clara, CA, 95052, United States
Sriram Anjur
Affiliation:
Sriram_Anjur@cabotcmp.com, Cabot Microelectronics, Aurora, IL, 60504, United States
Mansour Moinpour
Affiliation:
mansour.moinpour@intel.com, Intel Corporation, Santa Clara, CA, 95052, United States
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Abstract

Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.

Keywords

CMPmicroelectro-mechanical (MEMS)sensor
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1085: Symposium T – Nanoscale Tribology–Impact for Materials and Devices , 2008 , 1085-T05-11
Copyright
Copyright © Materials Research Society 2008

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References

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