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The Microstructure of Co Nanoparticles Directly Deposited on Si (001) Substrates Using DC Magnetron Sputtering

Published online by Cambridge University Press:  11 February 2011

Bing-Xian Chung ,
Chuan-Pu Liu  and
Jiun-Nan Chen
Bing-Xian Chung
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan
Chuan-Pu Liu
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan
Jiun-Nan Chen
Affiliation:
Department of Electrical Engineering, Fortune Institute of Technology, Kaohsiung, Taiwan
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Abstract

Dispersive cobalt nanoparticles are fabricated directly on Si (001) substrates by DC magnetron sputtering at room temperature. During deposition, the parameters chosen for the investigation are substrate bias (from +525 To –100 Volts), target-to-substrate distance (from 6 to 12 cm) and deposition time (from 10 to 30m sec), while the other parameters are kept the same, including the power of 50 watts. Atomic force microscope (AFM) is employed to determine the density and morphology of cobalt nanoparticles whereas high-resolution electron microscope (HRTEM) is used to visualize the resulting microstructure in the nanoparticles. It is found that Co nanoparticle array can be formed by combining the optimum substrate bias and target-to-substrate distance. The size uniformity of the nanoparticle array can be enhanced by positive bias due to charging effects. The nanoparticle of as small as a few nanometers can be successfully fabricated by DC-sputtering and can be applied to nanotube growth as catalysts.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 737 , 2002 , F8.35
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1. Wu, M. L., Qian, W. D., Chung, Y. W., Wang, Y. Y., Wong, M. S., Sproul, William D., Thin Solid Films, Vol. 308, 113 (1997).Google Scholar
2. Takeyama, M., Noya, A., & Sakanishi, K., J. Vac. Sci. Technol., B18, No.3, 1333 (2000).Google Scholar
3. Yanagisawa, H., Sasaki, K., Abe, Y., Kawamura, M., & Shinkai, S., Jpn. J. Appl. Phys., Vol.37, 5715 (1998).Google Scholar
4. Nomura, K., Noya, A., Sasaki, K., & Sunaga, K., Jpn. J. Appl. Phys., Vol.33, L880 (1994).Google Scholar
5. Yanagisawa, H., Sasaki, K., Miyake, H., & Abe, Y., Jpn. J. Appl. Phys., Vol.39, 5987(2000).Google Scholar
6. Smith, Donald L., Thin-Film Deposition Principles and Practice, Chapter 1. 2 .5.Google Scholar