Hostname: page-component-84b7d79bbc-c654p Total loading time: 0 Render date: 2024-07-27T06:43:57.423Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructure-Based Simulation of the Dielectric Properties of Polymer-Ceramic Composites for Capacitor Applications

Published online by Cambridge University Press:  01 February 2011

Jeffrey P. Calame
Jeffrey P. Calame*
Affiliation:
jeffrey.calame@nrl.navy.mil, Naval Research Laboratory, Code 6843, 4555 Overlook AV SW, Washington, DC, 20375, United States, 202-404-2799, 202-767-1280
Get access

Abstract

Research on the microstructure-based modeling of composite dielectrics for capacitor applications is described. Methods for predicting the composite dielectric permittivity and internal electric field distributions within the microstructure using finite difference quasi-electrostatic modeling are described, along with methods of generating realistic model spaces of particulate microstructures. An existing algorithm for generating random, monosized spheres-in-a-dielectric matrix model spaces is modified to allow the treatment of bimodal composites in which small particles are deliberately segregated into the spaces between large particles. Such composites can have substantially higher total volumetric filling fractions of particles, leading to higher composite permittivity. The variations in permittivity with the filling fractions of bimodal inclusions are studied with the new model, with cases covering three different types of polymer matrix material. The effect of the small particle additions on the electric field statistics within the polymer matrix is also explored.

Keywords

dielectriccompositepolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 949: Symposium C – Smart Dielectric Polymer Properties, Characterization and Their Devices , 2006 , 0949-C05-01
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Calame, J. P., J. Appl. Phys. 99, 084101 (2006).Google Scholar
2. An, L., Boggs, S. A., and Calame, J. P., IEEE Electrical Insulation Magazine 23, (2007) (in press)Google Scholar
3. Calame, J. P., J. Appl. Phys. 94, 5945 (2003); see also J.P. Calame, J. Appl. Phys. 97, 019901 (2005).Google Scholar
4. Arit, G., Hennings, D., and deWith, G., J. Appl. Phys. 58, 1619 (1985).Google Scholar
5. Kinoshita, K. and Yamaji, A., J. Appl. Phys. 47, 371 (1976).Google Scholar
6. Cheng, B. L., Gabbay, M., Maglione, M., and Fantozzi, G., J. Electroceramics 10, 5 (2003).Google Scholar
7. Bobnar, V., Vodopivec, B., Levstik, A., Kosec, M., Hilczer, B., and Zhang, Q. M., Macromolecules 36, 4436 (2003).Google Scholar
8. R. Gregorio Jr. and Ueno, E. M., J. Mater. Sci. 34, 4489 (1999).Google Scholar
9. Blech, I. A., in Electronics Engineers Handbook, edited by Fink, D.G. and D., Christiansen (MaGraw-Hill, New York, 1982), section 6.Google Scholar