Hostname: page-component-77c89778f8-7drxs Total loading time: 0 Render date: 2024-07-20T05:26:18.718Z Has data issue: false hasContentIssue false

Modification of the Silicon Surface by Electroless Deposition of Platinum from HF Solutions

Published online by Cambridge University Press:  10 February 2011

P. Gorostiza
Affiliation:
Departament de Química Física, Universitat de Barcelona
J. Servat
Affiliation:
Departament de Química Física, Universitat de Barcelona
R. Diaz
Affiliation:
Departament de Química Física, Universitat de Barcelona
F. Sanz*
Affiliation:
Departament de Química Física, Universitat de Barcelona
J. R. Morante
Affiliation:
Departament de Física Aplicada i Electrónica, Universitat de Barcelona Av Diagonal, 647. E-08028 Barcelona (Spain)
*
1 Corresponding Author, e-mail: f.sanz@dept.qf.ub.es
Get access

Abstract

Platinum electroless deposition on Si(lOO) from HF solutions is hindered on n+ substrates as compared to p-substrates defining an induction period and displaying a more local behavior. The results are discussed in terms of a global electrochemical process. Platinum reduces injecting holes to the silicon valence band and silicon atoms oxidizes. The final morphological situation is a porous silicon layer which contains platinum nuclei formed by filling pits originated in the first stages of the deposition process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Brenner, A. and Riddell, G.E., J. Res. Natl. Bur. Stan. 37, p. 31 (1946).Google Scholar
2. See, for example, Modern Electroplating, edited by Lowenheim, F.A., John Wiley & Sons Inc., New York (1974).Google Scholar
3. See, for example, Paunovic, M., Nguyen, T., Mukherjee, R., Sambucetti, C. and Romankiw, L. T., a) J. Electrochem. Soc. 142, p. 1,495 (1995) andGoogle Scholar
b) Mak, C.Y., MRS Bulletin XIX (8), p. 55 (1994).Google Scholar
4. See, for example, Arnold, A. F., U. S. Pat. 3,857,733 (1974) or the recipes in references 2,3.Google Scholar
5. Longo, C., Sumodjo, P. T. A., Sanz, F., J. Electrochem. Soc, submitted.Google Scholar
6. Stremsdoerfer, G., Perrot, H., Martin, J. R. and Cléchet, P., J. Electrochem. Soc, 135, p. 2881 (1988).Google Scholar
7. Nagahara, L.A., Ohmori, T., Hashimoto, K. and Fujishima, A., J. Electroanal. Chem., 333, p. 363(1992).Google Scholar
8. Nagahara, L.A., Ohmori, T., Hashimoto, K. and Fujishima, A., J. Vac. Sci. Technol. A, 11, p. 763 (1993).Google Scholar
9. Yoneshige, K. K., Parks, H. G., Raghavan, S., Hiskey, J. B., Resnick, P. J., J. Electrochem. Soc, 142, 671 (1995).Google Scholar
10. Chyan, O.M.R., Chen, J.J., Chien, H.Y., Sees, J. and Hall, L., J. Electrochem. Soc, 143, p. 92 (1996).Google Scholar
11. Gorostiza, P., Servat, J., Morante, J. R. and Sanz, F., Thin Solid Films, 275, p. 12 (1996).Google Scholar
12. Ohmi, T., Imaoka, T., Sugiyama, I. and Kezuka, T., J. Electrochem. Soc, 139, p. 3,317 (1992).Google Scholar
13. Morinaga, H., Suyama, M. and Ohmi, T., J. Electrochem. Soc, 141, p. 2834(1994).Google Scholar
14. Gorostiza, P., Servat, J., Sanz, F. and Morante, J. R., in Defect Recognition and Image Processing in Semiconductors, edited by Mickelson, A. R., (Institute of Physics Publishing Ltd. Bristol, UK 1996),p. 293 and references therein.Google Scholar
15. Gorostiza, P., Diaz, R., Servat, J., Sanz, F. and Morante, J. R., J. Electrochem. Soc, in press.Google Scholar
16. Gorostiza, P., Servat, J., Morante, J.R. and Sanz, F., in Suicide Thin Films Fabrication, Properties and Applications, edited by Tung, R., Maex, K., Pellegrini, P. W. and Allen, L. H., (Mater. Res. Soc Proc 402, Pittsburgh, PA 1996), p. 611.Google Scholar
17. Gorostiza, P., Diaz, R., Morante, J. R. and Sanz, F., J. Electrochem. Soc, submitted.Google Scholar
18. Fathauer, R.W., George, T., Ksendzov, A. and Vasquez, R.P., Appl. Phys. Lett 60, p. 995,(1992)Google Scholar
19. Allongue, P., in Advances in Electrochemical Science and Engineering, Vol. 4, Gerischer, H., Tobias, C. W., Editors, p.42, VCH Verlagsgesellschaft GmbH, Weinheim (1995).Google Scholar
20. Andsager, D., Hilliard, J, Hetrick, J.M., AbuHassan, L.H., Plisch, M. and Nayfeh, M.H., J. Appl. Phys 74, p. 4,783 (1993)Google Scholar
21. Pletcher, D., Walsh, F. C., Industrial Electrochemistry, 2nd. ed., Chapman and Hall, University Press, Cambridge (1990).Google Scholar