Hostname: page-component-77c89778f8-m42fx Total loading time: 0 Render date: 2024-07-24T00:58:31.238Z Has data issue: false hasContentIssue false

Nanoindentation Evaluation of Passive Film Stress and Growth Kinetics

Published online by Cambridge University Press:  10 February 2011

N. I. Tymiak
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, tymiak@cems.umn.edu
J. C. Nelson
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, tymiak@cems.umn.edu
W. W. Gerberich
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, tymiak@cems.umn.edu
D. F. Bahr
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA.
Get access

Abstract

Load controlled nanoindentation in conjunction with a potential step method were utilized for the investigation of precipitated iron sulfate film stresses and growth. Two types of experiments have been undertaken on thin sheet samples of Fe 3% Si single crystal in IM H2SO4. Samples were either allowed to deflect in the indentation direction or constrained. A distinctive difference between the indentation curves for the above two types of tests allowed separation of the effects of film stresses and local electrochemical processes. A proposed theoretical model accounting for both electrochemical and mechanical effects allowed modeling of the indenter tip motion following a potential step. Within the scope of the model, the time dependent film thickness (3.5 μm at maximum), electrostrictive film stress (330 MPa at maximum) have been determined.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sato, N.,., Electrochim. Acta, 16, p. 1683, (1971).Google Scholar
2. Bradhurst, D.H., and Leach, J.S.L., Trans.Br. Ceramic Soc., 62, p.93, (1963).Google Scholar
3. Wu, T.W., J.Mater.Res., 6, p. 407 , (1991).Google Scholar
4. Bahr, D.F, Nelson, J.C,. Tymiak, N.I., and Gerberich, W.W.,.J.Mater. Res., 12, p.3345, (1997).Google Scholar
5. Alkire, R., Ernsberger, D.,.Beck, T., J.Electrochem. Soc., 125, p. 1382, (1978)Google Scholar
6. Orazem, M.E. and Miller, M.G., J.Electrochem. Soc., 341, p. 393, (1987).Google Scholar
7. Beck, T., J. Electrochem. Soc., 129, p. 2412, (1982)Google Scholar
8. Archibald, L.S., Electrochim. Acta, 22, p. 57, (1977).Google Scholar
9. Nelson, J.C.. and Oriani, R.A, Corrosion Science., 34, p. 307, (1993).Google Scholar
10. Teschke, O., Soares, D.M., and Kleinke, M.U.,.Langmuir, 5, p. 1162, (1989).Google Scholar
11. Doener, M.F. and Nix, W.D., J. Mat er. Res., 1, p. 609 , (1986).Google Scholar
12. Tymiak, N.I. Nelson, J.C. Bahr, D.F. and Gerberich, W.W., accepted for publication in Corrosion Science. Google Scholar