Hostname: page-component-6d856f89d9-76ns8 Total loading time: 0 Render date: 2024-07-16T06:15:48.239Z Has data issue: false hasContentIssue false

Ni/Si-Based Ohmic Contacts to p- and n-Type GaN

Published online by Cambridge University Press:  10 February 2011

E. Kamińska
Affiliation:
Institute of Electron Technology, Al.Lotników 46, Warsaw, Poland, eliana@ite.waw.pl
A. Piotrowska
Affiliation:
Institute of Electron Technology, Al.Lotników 46, Warsaw, Poland, eliana@ite.waw.pl
A. Barcz
Affiliation:
Institute of Electron Technology, Al.Lotników 46, Warsaw, Poland, eliana@ite.waw.pl
M. Guziewicz
Affiliation:
Institute of Electron Technology, Al.Lotników 46, Warsaw, Poland, eliana@ite.waw.pl
S. Kasjaniuk
Affiliation:
Institute of Electron Technology, Al.Lotników 46, Warsaw, Poland, eliana@ite.waw.pl
M. D. Bremser
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7907 Aixtron AG, Kackertstrasse 15-17, Aachen, Germany
R. F. Davis
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7907
E. Dynowska
Affiliation:
Institute of Physics, PAS, Al.Lotników 46, Warszawa, Poland
S. Kwiatkowski
Affiliation:
Institute for Nuclear Studies, Hoza 69, Warszawa, Poland
Get access

Abstract

Ni/Si-based ohmic contact scheme for GaN, based on the solid-phase regrowth (SPR) mechanism have been developed. Using Mg and Si as dopant species, ohmic contacts with a resistivity of ∼1*10-3Ωcm2 to p-GaN (p≈3*1017 cm-3) and n-GaN (n≈2*1017cm-3), respectively, have been obtained. SIMS, XRD, and RBS analysis show in as-deposited contacts, an initial reaction at GaN/Ni interface, leading to the formation of an Ni-Ga-N layer. The ohmic behavior of contacts, observed after annealing at 400°C, is accompanied by structural transformations in the contact region: i) the decomposition of Ni-Ga-N layer and ii) the growth of NiSi compound.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lin, M.E., Ma, Z., Huang, F.Y., Fan, Z.F., Allen, L.H., Morkoc, H., Appl.Phys.Lett., 64, 1003 (1994).10.1063/1.111961Google Scholar
2. Nakamura, S., Senoh, M., Nagahama, S., Iwasa, N., Yamada, T., Matsushita, T., Sugimoto, Y., Kiyoku, H., Jpn.J.Appl.Phys. 36, L 1059 (1997).10.1143/JJAP.36.L1059Google Scholar
3. Akasaki, I., Amano, H., Sota, S., Sakai, H., Tanaka, T., Koike, M., Jpn.J.Appl.Phys. 34, L 1517 (1995).10.7567/JJAP.34.L1517Google Scholar
4. Ishikawa, H., Kobayashi, S., Koide, Y., Yamasaki, S., Nagai, S., Umezaki, J., Koike, M., Murakami, M., J.AppI.Phys. 81, 1315 (1997).10.1063/1.363912Google Scholar
5. Schottky, W., Naturwiss. 26, 843 (1938); N.F. Mott, Proc.Camb.Phil.Soc. 34, 568 (1938).10.1007/BF01774216Google Scholar
6. Kaminska, E., Piotrowska, A., Guziewicz, M., Kasjaniuk, S., Barcz, A., Dynowska, E., Bremser, M.D., Nam, O.H., Davis, R.F., Mat.Res.Soc.Symp.Proc. 449, 1055 (1997).10.1557/PROC-449-1055Google Scholar
7. Sands, T., Marshall, E.D., Wang, L.C., J.Mater.Res. 3, 914, 1988.10.1557/JMR.1988.0914Google Scholar
8. Wang, L.C., Zhang, B., Fang, F., Marshall, E.D., Lau, S.S., Sands, T., Kuech, T.F., J. Mater. Res. 3, 922 (1988).10.1557/JMR.1988.0922Google Scholar
9. Wang, L.C., Li, Y.Z., Kappes, M., Lau, S.S., Hwang, D.M., Schwartz, S.A., Sands, T., Appl. Phys. Lett. 60, 3016 (1992).10.1063/1.106794Google Scholar
10. Han, C.C., Wang, X.Z., Wang, L.C., Marshall, E.D., Lau, S.S., Schwarz, S.A., Palmstrom, C.J., Harbison, J.P., Florez, L.T., Potemski, R.M., Tischler, M.A., Kuech, T.F., J. Appl. Phys. 68, 5714 (1990).10.1063/1.346990Google Scholar
11. Kwak, J.S., Kim, H.N., Baik, H.K., Lee, J.-L., Shih, D.W., Park, C.G., Kim, H., Pyun, K.-E., J. Appl. Phys. 80, 3904 (1996).10.1063/1.363347Google Scholar
12. Park, M.-H., Wang, L.C., Hwang, D.M., J. Electron. Materials 25, 721 (1996).10.1007/BF02666530Google Scholar
13. Bermudez, V.M., Kaplan, R., Khan, M.A., Kuznia, J.N., Phys.Rev. B 48, 2436 (1993)10.1103/PhysRevB.48.2436Google Scholar
14. Tu, K.N., Mayer, J.W., Feldman, L.C., Electronic Thin Film, Macmillan Publishing Company, New York, 1992, p.302.Google Scholar
15. Weaks, T.W. Jr., Bremser, M.D., Ailey, K.S., Carlson, E., Perry, W.G., Piner, E.L., EI-Masry, N.A., Davis, R.F., J.Mat.Res., 10, 1011 (1996).10.1557/JMR.1996.0126Google Scholar
16. JCPDS Card No 7-150.Google Scholar