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Preparation of Planar and Cross-Sectional Thin Specimens by Chemical Dimpling with Optically Controlled Terminator

Published online by Cambridge University Press:  16 February 2011

D. M. Hwang ,
L. Nazar  and
C. Y. Chen
D. M. Hwang
Affiliation:
Bellcore, Red Bank, New Jersey 07701-7040, USA
L. Nazar
Affiliation:
Bellcore, Red Bank, New Jersey 07701-7040, USA
C. Y. Chen
Affiliation:
Bellcore, Red Bank, New Jersey 07701-7040, USA
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Abstract

We have modified a conventional dimpling machine to perform chemical polishing with a reactive etchant. The modified dimpler also detects specimen perforation in situ optically, and automatically stops the dimpling process by lifting the dimpler wheel and flooding the specimen with a rinse solution. Using this apparatus, we are able to prepare both planar and cross-sectional thin specimens of compound semiconductor materials without using expensive and time-consuming ion-milling. The specimens have large thin areas, are free of artifacts, and are suitable for high-resolution lattice imaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 199: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials II , 1990 , 309
Copyright
Copyright © Materials Research Society 1990

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References

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