The deposition of gold film onto aluminum alloy substrate was attempted by the Ionized Cluster Beam(ICB) deposition process. The adhesive strength, reflectivity, and geometrical accuracy(conformance to specifications) were evaluated for the films deposited under various acceleration voltages and substrate temperatures. The film-substrate interface was examined by Auger electron spectroscopy and x-ray diffraction. A gold film with reflectivity of 99.2 % and an adhesive strength of over 4–0 N/mm2 was obtained by ICB deposition at room temperature. It was established that a high adhesive strength can be achieved by ICB deposition even if a surface oxide layer on the substrate remains.