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Quantitative Measurements of Subcritical Debonding of Cu Films from Glass Substrates

Published online by Cambridge University Press:  01 February 2011

M. Pang  and
S.P. Baker
M. Pang
Affiliation:
Cornell University, Department of Materials Science and Engineering Bard Hall, Ithaca, NY, 14853
S.P. Baker
Affiliation:
Cornell University, Department of Materials Science and Engineering Bard Hall, Ithaca, NY, 14853
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Abstract

Subcritical debonding of Cu films from silicate glass substrates has been studied using a driver film method. In this method, a highly stressed Cr overlayer is imposed to debond the target Cu film from the substrate. Substrates included a commercial flat panel display glass and glasses having composition (2SiO2)x(CaO·Al2O3)1-x. A range of strain energy densities for driving interfacial crack growth was provided by depositing Cr driver layers with varying thickness. The film debond velocity was obtained experimentally. The stresses in Cu and Cr were measured and used to obtain the strain energy release rate. The effect of oxygen concentration and substrate composition on subcritical debonding was studied. A kinetic crack model previously developed for bulk ceramics was modified and applied. Differences in adhesion could be attributed to differences in density of strong Cu-O bonds across the interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 766: Symposium E – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 , 2003 , E2.8
Copyright
Copyright © Materials Research Society 2003

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References

1. Volinsky, A. A., Moody, N.R. and Gerberich, W.W., Acta Mater. 50, 441, (2002).Google Scholar
2. Lane, Michael, Dauskart, Reinhold H., Vainchtein, Anna and Gao, Huajian, J. Mater. Res. 15, 2758, (2000).Google Scholar
3. Bagchi, A. and Evans, A.G., Thin Solid Films, 286, 203, (1996).Google Scholar
4. Shu, J., Clyburn, S., Mates, T., and Baker, S.P., submitted to J. Mater. Res. 2003.Google Scholar
5. Pang, M., Wang, X. and Baker, S.P., in preparation, 2003.Google Scholar
6. Dauskardt, R. H., Lane, M., Ma, Q. and Krishna, N., Eng. Frac. Mech. 61, 141, (1998).Google Scholar
7. Oh, T.S., Cannon, R.M., Ritchie, R. O., J Am Ceram Soc 70 C352 (1987).Google Scholar
8. Scheu, S., Dehm, G., Rühle, R., and Brydson, R., Phil Mag A, 78, 439, (1998).Google Scholar
9. Backhaus-Ricoult, M., Samet, L., Thomas, M., Trichet, M. F. and Imhoff, D., Acta Mater. 50, 4191, (2002).Google Scholar
10. Lopez, Nuria, Ullas, Francese, and Pacchioni, Gianfranco, J. Phys Chem B. 103, 1712, (1999).Google Scholar
11. Johnson, K. H. and Pepper, S.V., J. Appl. Phys. 53, 6634, (1982).Google Scholar
12. Lawn, B. R., J. Mat. Sci., 10, 469, (1975).Google Scholar
13. Cook, Robert F. and Liniger, Eric G., J. Am. Ceram. Soc. 76, 1096, (1993).Google Scholar
14. Pang, M. and Baker, S.P., in preparation, 2003.Google Scholar