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Real-Time Thermo-Mechanical and Adhesive Property Evaluation of Thin Films and Multi-Layers
Published online by Cambridge University Press: 22 February 2011
Abstract
We describe an experimental method useful for in-situ real-time evaluation of viscoelastic, thermal and adhesive properties of thin films and multi-layer structures. We demonstrate how the technique is used to quantify the elastic moduli, and in-plane thermal diffusivity. We also show how it can be used to “spot check” for dis-bonds and to generate dis-bond “maps”.
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- Research Article
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- Copyright © Materials Research Society 1994
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