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Residual Stress and Microstructure of CU/W Multilayers

Published online by Cambridge University Press:  15 February 2011

Ph. Goudeau ,
K.F. Badawi ,
A. Naudon  and
N. Durand
Ph. Goudeau
Affiliation:
Laboratoire de Métallurgie Physique (URA 131 CNRS), Université de Poitiers, 40 avenue du Recteur Pineau, 86022 Poitiers cedex, France.
K.F. Badawi
Affiliation:
Laboratoire de Métallurgie Physique (URA 131 CNRS), Université de Poitiers, 40 avenue du Recteur Pineau, 86022 Poitiers cedex, France.
A. Naudon
Affiliation:
Laboratoire de Métallurgie Physique (URA 131 CNRS), Université de Poitiers, 40 avenue du Recteur Pineau, 86022 Poitiers cedex, France.
N. Durand
Affiliation:
Laboratoire de Métallurgie Physique (URA 131 CNRS), Université de Poitiers, 40 avenue du Recteur Pineau, 86022 Poitiers cedex, France.
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Abstract

We have determined residual stresses and the layer microstructure in as-prepared Cu/W multilayers of different periods ranging from 5.2 to 20 nm by both X-ray diffraction and the curvature radius method. The magnitude of the principal in-plane stress is large in the W layers (around - 6 GPa) and small in the Cu layers (-0.5 - + 0.5 GPa). The stress state is independent of the multilayer period. Under the compressive stress, the W cubic unit cell becomes monoclinic-like. The stress-free lattice parameter is found higher than the bulk one.

We also studied the stress relaxation and the layer microstructure modification in W layers induced by Kr ion irradiation., the relaxation is almost achieved after only low fluence irradiations and the decrease of the stress-free lattice parameter in W layers observed for higher fluences is attributed to the formation of a sursaturated solid solution W(Cu).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 713
Copyright
Copyright © Materials Research Society 1993

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References

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