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Saturation behavior of the Light-Induced Defect Density in Hydrogenated Amorphous Silicon

Published online by Cambridge University Press:  25 February 2011

H. R. Park
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
J. Z. Liu
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
P. Roca i Cabarrocas
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
A. Maruyama
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
M. Isomura
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
S. Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
J. R. Abelson
Affiliation:
Materials Science and Engineering Department and Coordinated Science Laboratory, University of Illinois at Urbana-Champain, Urbana, Illinois 61801
F. Finger
Affiliation:
Institute of Microtechnology, University of Neuchâtel, A.L. Bréguet 2, CH-2000 Neuchâtel, Switzerland
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Abstract

Using a Kr ion laser (λ = 647.1 nm) to produce a carrier generation rate G of 3 × 1020 cm−3s−1, we have saturated the light-induced defect generation in hydrogenated (and fluorinated) amorphous silicon (a-Si:H(F)), within a few hours near room temperature. While the defect generation rate scales roughly with 1/G2, the saturation defect densities Ns,sat are essentially independent of G. The saturation is not due to thermal annealing. We have further measured Ns,sat m 37 a-Si:H(F) films grown in six different reactors under different conditions. The results show that Ns,sat lies between 5 × 1016 and 2 × 1017 cm−3, that Ns,sat drops with decreasing optical gap and hydrogen content, and that Ns,sat is not correlated with the initial defect density or with the Urbach energy.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

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