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Simple Models for Surface Cracking

Published online by Cambridge University Press:  22 February 2011

Paul Meakin
Paul Meakin*
Affiliation:
Central Reseach and Development Department, E. I. du Pont de Nemours and Company, P. O. Box 80356, Wilmington, DE 19880-0356
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Abstract

A simple model for crack growth in thin films deposited onto a substrate has been developed. This model results in the generation of cracking patterns which have a remarkably realistic appearance. In the simulations a slow crack initiation period is followed by a period of rapid crack growth in which quite linear cracks are formed. Later on the crack growth process becomes slower and less regular as the cracking process relieves much of the stress in the surface layer. In this model pre-existing defects have a large effect on the crack growth kinetics and morphology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 243
Copyright
Copyright © Materials Research Society 1989

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References

1. Meakin, P., Thin Solid Films 151, 165 (1987).CrossRefGoogle Scholar
2. Eyring, H., J. Chem. Phys. 3, 107 (1953).CrossRefGoogle Scholar
3. Allen, D. M. de G, “Relaxation Methods”, McGraw Hill, New York (1954).CrossRefGoogle Scholar
4. Kinloch, A. J. and Young, R. J., Failure Behavior of Polymers, Applied Science, London (1983).Google Scholar
5. Skjeltorp, A. T., preprint (1988).Google Scholar
6. Skjeltorp, A. T. and Meakin, P., Nature 335, 424 (1988).10.1038/335424a0Google Scholar