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Size Effect in the Shear-Coupled Migration of Grain Boundaries Pinned by Triple Junctions
Published online by Cambridge University Press: 31 January 2011
Abstract
This paper presents molecular dynamics simulations of shear-coupled migration of tilt boundaries pinned by triple junctions in a simple model structure of columnar grains of different sizes. Simulations are for copper at 300 K. The phenomenon is of interest as a possible explanation of the Hall-Petch relationship breakdown in nano-grained polycrystals deformed at high or moderate strain rate and low-temperature.
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- Copyright © Materials Research Society 2010