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Spalling of Cu-Sn Compound Spheroids in Solder Joints on Si Wafers

Published online by Cambridge University Press:  10 February 2011

H.K. Kim  and
K.N. Tu
H.K. Kim
Affiliation:
Module Team, Memory Division, Samsung Electronics, Kihung-Eup, Yongin-City, Kyungki-Do, Korea 449-900
K.N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles CA 90095-1595
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Abstract

In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 27
Copyright
Copyright © Materials Research Society 1997

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References

1 Semiconductor Industry Association, “Semiconductor Technology Workshop Working Group Reports” (Semiconductor Research Cooperation, Research Triangle Park, NC.1992).Google Scholar
2 Tummala, R. R., Rymaszewski, E. J., Microelectronics Packaging Handbook (Van Nostrand Reinhold, New York, 1989).Google Scholar
3 Seraphim, D., Lasky, R., and Li, C. Y., Principles of Electronic Packaging (McGraw-Hill, New York, 1989).Google Scholar
4 Fried, L.J., Havas, J., Lechaton, J S., Logan, J.S., Paal, G., and Totta, P.A., IBM J. Res. Dev. 26, 362(1982).Google Scholar
5 Lau, John H., Chip on Board Technologies for Mullichip Modules (Van Nostrand Reinhold, New York, 1994).Google Scholar
6 Lau, John H., Rail Grid Array Technology (McGraw-Hill, New York, 1995).Google Scholar
7 Berry, B.S. and Ames, I., IBM J. Res. Dev. 13, 286 (1969).Google Scholar
8 Kim, H.K., Liou, H.K., and Tu, K.N., Appi. Phys. Lett. 66, 2337 (1995).Google Scholar
9 Kim, H.K. and Tu, K.N., Appi. Phys. Lett. 67, 2002 (1995).Google Scholar
10 Walker, P. and Tarn, W.H., CRC Handbook of Metal Etchants (CRC Press, Boca Raton, Florida, 1991).Google Scholar