Passivated Cu lines deposited by CVD, electroplating, and sputter-reflow were investigated using x-ray diffraction. Blanket films of the three types were measured for strain and texture post-deposition and after an anneal step to mimic the passivation temperature step. Texture in the CVD films was random, while the electroplated and sputtered films showed a strong {111} texture. Lines were then measured of each type. The measured strain was modeled using finite element calculations. While the strain in Cu was high compared to Al lines of similar geometry, no stress voiding was observed using high voltage scanning electron microscopy.