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Surface Smoothing Process of YBa2Cu3O7−x Thin Film for Fabrication of Superconducting Multi-Chip Modules

Published online by Cambridge University Press:  21 February 2011

S. Liang ,
Z.Q. Shi ,
C. Chern ,
Y. Lu ,
A. Safari ,
P. Lu  and
B.H. Kear
S. Liang
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Z.Q. Shi
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
C. Chern
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Y. Lu
Affiliation:
College of Engineering, Rutgers University, Piscataway, NJ 08855-0909.
A. Safari
Affiliation:
College of Engineering, Rutgers University, Piscataway, NJ 08855-0909.
P. Lu
Affiliation:
College of Engineering, Rutgers University, Piscataway, NJ 08855-0909.
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Abstract

In this paper, we report the development of surface smoothing process for YB2CU3O7. x (YBCO) films. The SrTi03/YBCO interface characteristics were investigated as functions of polishing agent and polishing time. It was found that the 7% HF solution gave the best results both in structural and electrical properties. The leakage current through the SrTiÛ3 film grown on polished YBCO was reduced to about 3 orders of magnitude. The dielectric constant was also increased from 110 to over 300. The superconducting properties of the YBCO bottom layer degraded insignificantly after undertaking the surface smoothing process and the overlayer growth of STO. This surface smoothing process without post treatment is suitable for subsequent growth of epitaxial STO films and the fabrication of MCM’s.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 318: Symposium Ca – Interface Control of Electrical, Chemical, and Mechanical Properties , 1993 , 665
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

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